VCSELs for high-speed data communication in TO packages: pushing the envelope

Aeby, Ian; Yang, Lei; Lavrova, O. A.; Ling, Hai; Collins, Doug; Wang, Charlie X.; Liu, Chiyu; Whittington, T.

doi:10.1117/12.601936

Cited by 6 publications

(3 citation statements)

References 4 publications

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“…Furthermore, most of the packages produced have lenses with prisms and narrow or wide-angle features for optical performance as they use infra-red chips and normal LEDs. In comparison to other studies, VCSEL packaging used the header and window cap as package components ( Seurin et al , 2016 ; Aeby et al , 2005 ) with a wavelength of 850 µm. Other VCSEL packaging developments used the sub-mount on the ceramic package with an output power ranging from 500 mW to 2 W, whereas this study used a huge wavelength and an output power of 4 W.…”

Section: Introductionmentioning

confidence: 99%

Packaging design and thermal analysis for 1 mm² high power VCSEL

Arshad

Noor²,

Manaf³

et al. 2022

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Purpose Vertical-cavity surface-emitting laser (VCSEL) is a high-performance semiconductor device made of unique epitaxial layers grown on n-type GaAs or InP substrates. The VCSEL’s thermal resistance, Rth, is an essential metric that reflects its thermal properties and dependability. The purpose of this paper is to develop packaging for 1 mm2 VCSEL chips made of a variety of materials, such as ceramic, lead frame and printed circuit board (PCB)-based packaging, as well as provide an idea or design that can withstand and perform well in terms of Rth and heat dissipation during operation. SolidWorks 2017 and AutoCAD Mechanical 2017 software were used to publish all thoughts and ideas, including the size dimensions (x, y and z) and material choices for each package. Design/methodology/approach Following the modelling and material selection, the next step is to use the Ansys Mechanical Structural FEA Analysis software to simulate all packaging for Rth and determine which packaging produced the best result, therefore, determining the heat dissipation for each packing. All parameters were used based on the standard cleanroom requirement for the industrial manufacturing backend process, where the cleanroom classification is 10,000 particles (ISO 7). The results demonstrated that the ceramic and lead frame provided good Rth values of 7.3 and 7.0 K/W, respectively, when compared to the PCB, which provided more than 80 K/W; thus, the heat dissipation for PCB packaging also increased. Findings As a result of the research, it was determined that ceramic and lead frame packaging are appropriate and capable of delivering good Rth and heat dissipation values when compared to PCB. In comparison to PCB, which requires numerous modifications, such as adding via holes and a thermal bar in an attempt to lower the Rth value, neither packaging requires improvement. Ceramic was chosen for development based on Rth's highest performance, with the actual device consisting of a lead frame and PCB. The Zth measurement test was carried out on a ceramic package, and the Rth result was comparable to the simulation result of 7.6 K/W, indicating that simulation was already proved for research and development. Originality/value The purpose of this study is to determine which proposed packaging design would give the highest Rth performance of a 1 mm2 chip as well as the best heat dissipation. In comparison to other studies, VCSEL packaging used the header and window cap as package components with a wavelength of 850 nm, and other VCSEL packaging developments used the sub mount on ceramic package with an output power ranging from 500 mW to 2 W, whereas this study used a huge wavelength and an output power of 4 W.

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Section: Introductionmentioning

confidence: 99%

Packaging design and thermal analysis for 1 mm² high power VCSEL

Arshad

Noor²,

Manaf³

et al. 2022

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“…The TO-46 header is a common packaging solution for vertical cavity surface emitting lasers (VCSELs) and photodetectors [6][7][8][9][10]. There are different versions available by number of pins, from 2 to 6.…”

Section: Introductionmentioning

confidence: 99%

“…TO-46 VCSEL module can provide a low-cost solution for high-bit-rate optical transmitter module. The 5-Gb/s and 10-Gb/s TO-46 VCSEL modules had been presented [6,10]. Recently, VCSELs have been developed to be modulated over 25-Gb/s [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Analysis of high frequency performance of TO‐46 header through three‐dimensional full wave electromagnetic model and circuit model

Shih

Jou

Chu

2015

Int J Numerical Modelling

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Summary The TO‐46 header has been commonly used for vertical cavity surface emitting laser (VCSEL) and photodetector package. The high‐frequency characteristics of a TO‐46 header were measured using our special K‐type adaptors and simulated through a three‐dimensional full wave electromagnetic simulator. The measurement and simulation results show the TO‐46 header provides a resonance‐free transmission bandwidth over 40‐GHz and reflection loss below −10‐dB within 31‐GHz, with an ideal 50‐Ω terminal. The 25‐Gb/s and 40‐Gb/s eye diagrams through a TO‐46 header were measured using our measurement setup, and the eye diagrams are clear enough. In addition, the single‐end and differential‐end equivalent circuit models of a TO‐46 header were established and verified. The TO‐46 header provides a low‐cost and high‐speed package solution and can be applied in 21‐Gb/s fiber channel technology and 100‐Gb/s (4 × 25‐Gb/s) Ethernet (100 GbE) network. Copyright © 2015 John Wiley & Sons, Ltd.

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