2013 Ieee Sensors 2013
DOI: 10.1109/icsens.2013.6688603
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UV-sensitive low dark-count PureB single-photon avalanche diode

Abstract: Abstract-A single-photon avalanche diode with high sensitivity in the ultraviolet (UV) wavelength range has been fabricated on Si using pure boron chemical vapor deposition to create both a nanometer-thin anode junction and a robust light entrance window. The device shows high sensitivity at the wavelengths of 330-370 nm when operated in the Geiger mode and good selectivity for UV light without applying a capping filter. The dark count rates can be as low as 5 Hz at room temperature for an active area of 7 µm … Show more

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Cited by 11 publications
(7 citation statements)
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References 21 publications
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“…Secondly, in structural approaches, various photodetector structures have been employed, including a metal-semiconductor-metal (MSM) photodiode, p-n and p-i-n photodiodes, an avalanche photodiode, a photoconductor, and a phototransistor 4,24 . Among them, the MSM structure with back-to-back Schottky contacts provides a low dark current, high S/N level, fast response speed, and compatibility for integration with other circuit components, particularly via simple fabrication methods 25,26 . The MSM-type structure can be fabricated in one step of electrode deposition on a semiconductor material without any deteriorations of device performance from the complicated processes of etching and diffusion, as well as those from the asymmetric traveling lengths of electrons and holes before reaching an electrode.…”
mentioning
confidence: 99%
“…Secondly, in structural approaches, various photodetector structures have been employed, including a metal-semiconductor-metal (MSM) photodiode, p-n and p-i-n photodiodes, an avalanche photodiode, a photoconductor, and a phototransistor 4,24 . Among them, the MSM structure with back-to-back Schottky contacts provides a low dark current, high S/N level, fast response speed, and compatibility for integration with other circuit components, particularly via simple fabrication methods 25,26 . The MSM-type structure can be fabricated in one step of electrode deposition on a semiconductor material without any deteriorations of device performance from the complicated processes of etching and diffusion, as well as those from the asymmetric traveling lengths of electrons and holes before reaching an electrode.…”
mentioning
confidence: 99%
“…The n-Si substrate had a nominal doping concentration of 10 15 cm −3 and an n-enhancement layer was formed under the anode by implanting phosphorus to achieve a local doping concentration of 10 17 cm −3 . A detailed description of the processing is given in [12] where similar PureB diodes were fabricated with the addition of a buried n + layer. Four circular diodes, on the same die were selected with diameters (d) of 8 µm, 15 µm, 20 µm and 30 µm; we label these diodes as J8, J15, J20 and J30 respectively.…”
Section: Experimental Amleds and Noisementioning
confidence: 99%
“…The almost ideal and reliable responsivity has been pivotal for the use of PureB layers in semiconductor detector devices for both NUV/VUV/EUV light 2 and low-energy electrons 4 detection. Research is also directed towards fabrication of PureB detectors for high-sensitivity in UV photon starved environments 5 or at low-radiation levels of electrons 6 .…”
Section: Introductionmentioning
confidence: 99%
“…Comparison of the measured5 and simulated DCR as a function of temperature at VEX = 6 V. Contributions of the BTBT, TAT and SRH DCR to the total DCR are indicated.…”
mentioning
confidence: 99%