1989
DOI: 10.1109/16.19959
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Two-dimensional simulation and measurement of high-performance MOSFETs made on a very thin SOI film

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Cited by 138 publications
(27 citation statements)
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“…At the same time, silicon on insulator (SOI) substrate demonstrate a number of merits for the VLSI designer such as reduced parasitic capacitance, and resistance to radiation [13]. Nevertheless the SOI technology has some disadvantages, the main of them is self-heating.…”
Section: Introductionmentioning
confidence: 99%
“…At the same time, silicon on insulator (SOI) substrate demonstrate a number of merits for the VLSI designer such as reduced parasitic capacitance, and resistance to radiation [13]. Nevertheless the SOI technology has some disadvantages, the main of them is self-heating.…”
Section: Introductionmentioning
confidence: 99%
“…suggested by several authors as an attractive future VLSI technology [1]- [3] due to the advantages that SOI devices show when compared to their conventional silicon counterparts, in particular with respect to radiation tolerance, lower parasitic capacitance and short channel effects [2]. These advantages indicate a tremendous potential for extremely thin SOI devices and promise a very encouraging future for both SOI and VLSI technologies.…”
Section: Ilicon-on-insulator (Soi) Technology Has Beenmentioning
confidence: 99%
“…While it is true that the parasitic bipolar is not significant for modeling normal device operation, it becomes a major factor in modeling single-event effects as "ill be discussed in the following subsections. In addition, even for modeling normal operating conditions, the models appear complex both numerically [46][47][48] and computationally [49][50][51][52][53] or are limited in device structures or range of operating conditions [54][55][56][57]. More recent characterization and modeling efforts have concentrated on the optimization of device designs and the effects of scaling the SOI devices to smaller device sizes and thinner active layers [58][59][60][61], but again the concentration is on normal device operation or post irradiation operation (for example, increases in leakage currents and shifts in threshold voltages [43,60] CMOS-SOI devices are distinguished from bulk MOS devices by a decreased charge collection volume reducing the direct perturbation of the device during the penetration of an ion (single event).…”
Section: General Model Considerationsmentioning
confidence: 99%