2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) 2020
DOI: 10.1109/eptc50525.2020.9315013
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Transient Thermal Evaluation of SiC Chip Based Power Module Under Different Cooling Conditions

Gongyue Tang
1
,
Kazuya Yamamoto
2
,
Leong Ching Wai
3
et al.
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Cited by 6 publications
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References 8 publications
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Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Tang
1
,
Wai
2
,
Lim
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
17
0
0
0
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Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Tang
1
,
Wai
2
,
Lim
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
17
0
0
0
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Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module

Tang
1
,
Yamamoto
2
2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
5
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0
0
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Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module

Tang
1
,
Wai
2
,
Feng
3
2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3
0
0
0
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