Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module

Tang, Gongyue; Yamamoto, Kazunon

doi:10.1109/ectc51906.2022.00093

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Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module

Cited by 5 publications

References 7 publications

Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating

Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating

Thermal Management of 6-in-1 SiC Power Module with Double-Sided Impingement Cooling

Double-side Liquid Cooling Development for 6-in-1 SiC Power Module

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