Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Tang, Gongyue; Wai, Leong Ching; Lim, Siak Boon; Ye, Yong Liang; Lau, Boon Long; Yamamoto, Kazuya; Zhang, Xiaowu

doi:10.1109/ectc32696.2021.00031

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Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Cited by 15 publications

References 8 publications

Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating

Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating

3D Embedded Power Package Module to Integrate Various Power Systems

Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module

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