International Technical Digest on Electron Devices Meeting
DOI: 10.1109/iedm.1989.74232
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Transient hot-electron effect on n-channel device degradation (MOSFETs)

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Cited by 16 publications
(1 citation statement)
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“…The remarkably enhanced device degradation with the case of small output load can be explained by the transient hole injection during the turn-off time of the gate pulse in the period of gate falling edge [4], [SI. In the case of the inverter-type stress, the transient hot-carrier injection during the gate falling time has caused more severe device degradation than during the gate rising time [4], [5]. We have also observed such phenomena in the transistors under dynamic stress (not reported here).…”
Section: Hot-carrier Effects In Transistorssupporting
confidence: 55%
“…The remarkably enhanced device degradation with the case of small output load can be explained by the transient hole injection during the turn-off time of the gate pulse in the period of gate falling edge [4], [SI. In the case of the inverter-type stress, the transient hot-carrier injection during the gate falling time has caused more severe device degradation than during the gate rising time [4], [5]. We have also observed such phenomena in the transistors under dynamic stress (not reported here).…”
Section: Hot-carrier Effects In Transistorssupporting
confidence: 55%