2010 Fourth ACM/IEEE International Symposium on Networks-on-Chip 2010
DOI: 10.1109/nocs.2010.32
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Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems

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Cited by 114 publications
(59 citation statements)
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“…For communication-centric applications, TL maps the edges with larger communication volumes to vertical links, while for computation-centric applications, TL attempts to map the tiles to the bottom layer. Most DTM methods, like those proposed in [4,[21][22], use dynamic voltage/frequency scaling (DVFS) to control the voltage/frequency of the components so that the temperature can be controlled eventually. However, DVFS requires additional circuits which might incur additional hardware cost.…”
Section: Thermal Management Approaches For 3-d Nocmentioning
confidence: 99%
“…For communication-centric applications, TL maps the edges with larger communication volumes to vertical links, while for computation-centric applications, TL attempts to map the tiles to the bottom layer. Most DTM methods, like those proposed in [4,[21][22], use dynamic voltage/frequency scaling (DVFS) to control the voltage/frequency of the components so that the temperature can be controlled eventually. However, DVFS requires additional circuits which might incur additional hardware cost.…”
Section: Thermal Management Approaches For 3-d Nocmentioning
confidence: 99%
“…• C under high traffic [2]. Such high temperatures result in 4% -10% fault probabilities (bottom subfigure of Figure 6) for a chip that is fault-free in nominal conditions.…”
Section: Fault Probabilities At Runtimementioning
confidence: 99%
“…AnYeu Wu and his teammates continuously propose a variety of routing policies [5,6,7,8,9,10,11]. However, those routing algorithms only choose routing path based on local temperature and throughput, and it doesn't consider a solution for the traffic balance problem.…”
Section: Introductionmentioning
confidence: 99%