IONThermal issue is one of the major challenges in the research field of three-dimensional (3D) IC. Network-on-Chip (NoC) has been viewed as a practical communication infrastructure for 3D IC. To facilitate such research, an accurate and non-proprietary environment for simulating the NoC traffic and temperature is necessary. In this paper, we present a traffic-thermal mutual-coupling co-simulation platform for 3D NoC. The translation error is eliminated, and therefore our co-simulation has no accuracy loss on mutual coupling. Our simulation results, validated with a commercial tool, show the temperature error of our platform is between -1 and 4 K. The simulation results also show the thermal profile of 3D NoC, in which the temperature is imbalance even under the balanced traffic. Hence, the proposed platform can be used for 3D thermal-aware design, 3D dynamic thermal management technology, and other related researches in the future.
Abstract-A novel on-line Mixed-Scaling-Rotation CORDIC (MSR-CORDIC) VLSI architecture is proposed. This architecture not only maintains the scaling-free property of the original MSR-CORDIC, but also achieves the target of on-line angle computation. Compared with other existing CORDIC solutions, the proposed architecture is faster and more cost-efficient, especially for QRD-RLS filtering systems. Moreover, this on-line MSR-CORDIC can also be adopted by other rotation-based DSP applications.
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