Tin electrodeposition from choline chloride based solvent: Influence of the hydrogen bond donors

Salomé, Sónia; Pereira, Nuno M.; Ferreira, Elisabete S.C.; Pereira, Carlos M.; Silva, A. Fernando

doi:10.1016/j.jelechem.2013.05.007

Cited by 64 publications

(36 citation statements)

References 56 publications

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“…Figure shows the linear relationship between current density j and t ‐ 1/2 (the fitting correlation coefficient is 0.9999) at the potential of −0.5 V, indicating that the tin membrane electrodeposition process is diffusion‐controlled under our experimental conditions . The slope of this line could be used to calculate the diffusion coefficient to be 3.93E‐11 m 2 s −1 , which is very close to the value 3.99E‐11 m 2 s −1 obtained from parameter P 1 (Table ).…”

Section: Resultsmentioning

confidence: 98%

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Lei

Yang

2016

J of Chemical Tech & Biotech

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BACKGROUND A new membrane electro‐deposition based process for tin recovery from stannous solid waste was introduced. Linear sweep voltammetry (LSV), cyclic voltammetry (CV) and chronoamperometry (CHR) was applied to investigate the electrodeposition of tin(II) from a stannous chloride acid electrolyte containing an amine non‐ionic surfactant by using a membrane cell. RESULTS Electrochemical mechanism analysis results showed that 0.3% vol. amine non‐ionic surfactant facilitated ions diffusion by increasing the diffusion coefficient from 8.32E‐12 m2 s−1 to 2.85E‐11 m2 s−1, and inhibited tin(II) ions reduction as well as tin nucleation and hydrogen evolution. The applied ionic membrane did not hinder tin electrodeposition, while tin(II) ions reduction and hydrogen evolution was weakened with increasing HCl concentration from 1.5 to 4.5 mol L−1 and Sn2+ concentration increased from 20 to 80 g L−1. CONCLUSIONS The tin(II) reduction process is proved to be irreversible and diffusion‐controlled, while the nucleation and growth of tin was involved in the process of diffusion for the proton reduction occuring in parallel with tin electrodeposition, and the process follows the mechanism of three‐dimensional instantaneous nucleation and subsequent grain growth limited by diffusion. © 2016 Society of Chemical Industry

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Section: Resultsmentioning

confidence: 98%

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Lei

Yang

2016

J of Chemical Tech & Biotech

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“…34 The mixing occurred at 60 C with vigorous stirring until a homogeneous liquid was obtained. As for physical and chemical properties, namely viscosity and densities, these are widely known in the proportions used, with DES-E presenting a viscosity of 16 cP, whereas DES-U is more viscous (167 cP) at a temperature of 348.15 K. The density of both fall within a range of 0.99-1.20 gÁcm −3 at a temperature of 298.15 K. However, it should be noted that these properties tend to change significantly when mixed with water, [35][36][37] as happens here with the actual synthesis of the composites (cf. next section).…”

Section: Preparations Of Desmentioning

confidence: 99%

Cation‐bioimprinted mesoporous polysaccharide/sol–gel composites prepared in media containing choline chloride‐based deep eutectic solvents

Ferreira

Azenha

Pereira

et al. 2019

J of Applied Polymer Sci

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A study on the Pb(II) imprinting performed within mesoporous sulphated biopolymer/siloxane composites, prepared in media containing deep eutectic solvent (DES), is described. In general, the process of imprinting resulted in greatly increased surface areas relatively to the corresponding nonimprinted composites [up to fivefold (from 76 m2 g−1 to 360 m2 g−1) for fucoidan (Fuc) and up to twofold (from 208 m2 g−1 to 351 m2 g−1) for chondroitin sulfate (CS) composites], the diminishing of mean pore size (from 3.3–4.6 nm to 2.9–3.4), and higher biopolymer contents (from mass fractions of 0.42–0.52 to 0.46–0.68). The sorption features depended a great deal on the biopolymer/DES combination. The best CS composite, allowed for 12% capacity and 20% binding strength, as well as Pb(II)/Cd(II) selectivity enhancements. The largest of the capacities was obtained with the imprinted Fuc/DES‐E composite, 86 mg g−1, a 10% increase. Concerning the selectivity [Pb(II) versus Cd(II)], there was a significant increase for the CS composites (from 1.0–1.1 (αqmax)/1.1–1.2 (αK) to 1.3–1.4 (αqmax)/1.3–1.6 (αK)]. In particular, the DES‐E CIC presented high selectivity factors (αqmax 3.0/αK 3.2) in line with those of the microporous version (αqmax 2.0/αK 3.3) but showing a significant increase in terms of the αqmax selectivity. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48842.

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“…9 DESs are systems formed from eutectic mixtures of Brønsted or Lewis acids and bases, typically mixtures of the salt choline chloride with small hydrogen bonding molecules such as ethyleneglycol or urea. 8 They have been used for the electrodeposition of a wide range of metal and alloy coatings including copper, 10,11 tin, [12][13][14] zinc, 15,16 chromium, 17,18 zinc/nickel 19 and zinc/tin. 20 Thus far there have been limited studies investigating the additive effect in DESs.…”

Section: Introductionmentioning

confidence: 99%

Bright metal coatings from sustainable electrolytes: the effect of molecular additives on electrodeposition of nickel from a deep eutectic solvent

Abbott

Ballantyne

Harris

et al. 2017

Phys. Chem. Chem. Phys.

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Organic and inorganic additives are often added to nickel electroplating solutions to improve surface finish, reduce roughness and promote uniform surface morphology of the coatings. Such additives are usually small molecules and often referred to as brighteners or levellers. However, there have been limited investigations into the effect of such additives on electrodeposition from ionic liquids (ILs) and deep eutectic solvents (DESs). Here we study the effect of four additives on electrolytic nickel plating from an ethyleneglycol based DES; these are nicotinic acid (NA), methylnicotinate (MN), 5,5-dimethylhydantoin (DMH) and boric acid (BA). The additives show limited influence on the bulk Ni(II) speciation but have significant influence on the electrochemical behaviour of Ni deposition. Small concentrations (ca. 15 mM) of NA and MN show inhibition of Ni(II) reduction whereas high concentrations of DMH and BA are required for a modest difference in behaviour from the additive free system. NA and MN also show that they significantly alter the nucleation and growth mechanism when compared to the additive free system and those with DMH and BA. Each of the additive systems had the effect of producing brighter and flatter bulk electrodeposits with increased coating hardness but XRD shows that NA and MN direct crystal growth to the [111] orientation whereas DMH and BA direct crystal growth to the [220] orientation.

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Tin electrodeposition from choline chloride based solvent: Influence of the hydrogen bond donors

Cited by 64 publications

References 56 publications

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Cation‐bioimprinted mesoporous polysaccharide/sol–gel composites prepared in media containing choline chloride‐based deep eutectic solvents

Bright metal coatings from sustainable electrolytes: the effect of molecular additives on electrodeposition of nickel from a deep eutectic solvent

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