The use of deep eutectic solvents (DES) for metal electrodeposition has become an area of interest in the recent years however the use of additives on the electrodeposition from deep eutectic solvents is still an unexplored area. In this study we describe the influence of the tartrate ion on the deposition mechanism of zinc and on the resultant morphology of the deposits. Electrochemical techniques were used to characterize the deposition process and scanning electron microscopy was used to study the deposit morphology. It is shown that the presence of potassium hydrogen tartrate in ethaline does not alter the generic voltammetric profile of zinc in solution but in contrast the presence of tartaric acid cause major modifications. From the analysis of the chronoamperometric transients a 3D progressive nucleation mechanism is proposed for the deposition of zinc in absence and in the presence of potassium hydrogen tartrate. In the presence of tartaric acid a 2D progressive nucleation mechanism is proposed for the initial part of the deposition then changing to a 3D progressive mechanism. The SEM images reveal that both additives change the morphological characteristics of the deposits. However the use of tartaric acid introduces a more dramatic change.

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The use of deep eutectic solvents for metal electrodeposition has become an area of interest in the recent years. In this study, ethaline, propeline, and reline were used as solvents for the electrodeposition of Sn-Zn alloys. Ethaline, propeline, and reline displayed identical voltammetric profiles for the reduction of Zn(II) and Sn(II). Further studies were carried out in ethaline which is the liquid with lowest viscosity. To improve physical and morphological properties of the Sn-Zn deposits, additives were added to the ionic liquid solution. In this study, the addition of three chelators (EDTA, HEDTA, and Idranal VII) and their effects on the voltammetric behavior of zinc and tin and the resultant morphology was described. The structure and composition of the Zn-Sn deposit was largely affected by the additives with the largest effect being obtained in the presence of Idranal VII.

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Zn alloys are considered an alternative to replace Cd in protective coatings. Among Zn alloys, Zn-Ni are those with the higher corrosion resistance and better mechanical characteristics. Although Zn-Ni alloy can be electrodeposited from eutectic-type ionic liquid the morphology of the deposits needs to be improved. The effect of ethylamine and ethylenediamine on the electrodeposition of Zn-Ni alloy was investigated from a eutectic-type ionic liquid (ethaline). The presence of the amines in the plating bath modified the CV and j-t profiles. The nucleation mechanism was also influenced by adding the amines to the solution and the deposition of Zn-Ni in the presence of ethylenediamine followed the 3D progressive mechanism. Electrodeposition of Zn-Ni alloy from ethaline gives origin to a deposit with small grain particles with partial coverage of the electrode. Using the same electrodeposition conditions, the addition of amines allowed the full coverage of the electrode surface. In the presence of ethylamine deposit was formed by globular particles and by hexagonal platelets for deposits obtained in the presence ethylenediamine. Corrosion of the Zn-Ni metallic films was evaluated by potentiodynamic polarization experiments. The lowest value for the corrosion potential was obtained for the deposit prepared in the presence of ethylenediamine.

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