Three-dimensional passive circuit technology for ultra-compact MMICs

Hirano, Hirohiko; Nishikawa, Kenjiro; Toyoda, Ichihiko; Aoyama, Shigeru; Sugitani, Suehiro; Yamasaki, K.

doi:10.1109/22.475644

Cited by 62 publications

(10 citation statements)

References 6 publications

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“…In recent years, however, Japanese industry has been pioneering ways of increasing levels of integration. For example, NTT developed an ultra-compact 3-D passive circuit technology [5] and also its 'master-slice' technology [6]. With the former, 10 mm vertical gold walls and microwires have been constructed in air.…”

Section: Multilayermentioning

confidence: 99%

Review of radio frequency microelectromechanical systems technology

Lucyszyn

2004

IEE Proceedings - Science, Measurement and Technology

124

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A review of radio frequency microelectromechanical systems (RF MEMS) technology, from the perspective of its enabling technologies (e.g. fabrication, RF micromachined components and actuation mechanisms) is presented. A unique roadmap is given that shows how enabling technologies, RF MEMS components, RF MEMS circuits and RF microsystems packaging are linked together; leading towards enhanced integrated subsystems. An overview of the associated fabrication technologies is given, in order to distinguish between the two distinct classes of RF microsystems' component technologies; non-MEMS micromachined and true MEMS. An extensive literature survey has been undertaken and key papers have been cited; from these, the motivations behind different RF MEMS technologies are highlighted. The importance of understanding the limitations for realising new and innovative ideas in RF MEMS is discussed. Finally, conclusions are drawn as to where future RF MEMS technology may lead. It is likely that the switch will continue to be the most important RF MEMS component, with future work investigating its enhanced functionality, subsystem integration and volume production. The focus of RF MEMS circuits will shift from the digital phase shifter to high-Q tuneable filters.

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Section: Multilayermentioning

confidence: 99%

Review of radio frequency microelectromechanical systems technology

Lucyszyn

2004

IEE Proceedings - Science, Measurement and Technology

124

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“…As a material with mature technology, silicon is increasingly used for higher frequencies as well, both on standard silicon (5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20) cm) as well as on high-resistivity silicon ( 1000 cm) [1], [2], [17].…”

Section: Onolithic Microwave Integrated Circuits (Mmic's)mentioning

confidence: 99%

“…Very complicated three-dimensional multilayer structures have been shown using several polyimide and metallization layers [5].…”

Section: Onolithic Microwave Integrated Circuits (Mmic's)mentioning

confidence: 99%

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Transmission lines and passive elements for multilayer coplanar circuits on silicon

Warns

Menzel

Schumacher

1998

IEEE Trans. Microwave Theory Techn.

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Abstract-In this paper, propagation properties of both standard and multilayer coplanar lines on different types of silicon substrates, as well as a number of quasi-lumped and stub-type circuit elements, are investigated. For the transmission lines, emphasis is placed on losses. As examples for circuit elements, a lumped parallel resonator and a high-low impedance low-pass filter are demonstrated.

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“…The three-dimensional MMIC has a multilayered thin-film structure in which dielectrics such as polyimide are stacked on a GaAs or Si substrate; it is highly effective for increasing the degree of integration [6][7][8][9][10]. When active devices and passive devices are formed on different layers in the multilayered configuration, the efficiency of area use can be improved substantially.…”

Section: Introductionmentioning

confidence: 99%

Miniaturized branch‐line hybrid circuit using 3D MMIC quasi‐distributed TFMS lines

Tanaka¹,

Nishikawa²,

Aikawa³

2006

Electron Comm Jpn Pt II

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SUMMARYThis paper discusses a miniaturized branch-line hybrid circuit consisting of quasi-distributed TFMS lines, making use of the topological characteristics of the threedimensional MMIC. In the three-dimensional MMIC, it is possible to reduce the coupling between adjacent transmission lines due to their very fine structure. Hence, miniaturized meander-like lines can easily be realized. Further, due to the stacking effect in this technique, MIM (metal-insulator-metal) capacitors can easily be installed into the transmission line. In this paper, by utilizing these effects, a transmission line consisting of high-impedance TFMS lines and MIM capacitors is proposed. The TFMS line of this type is here called a QD-TFMS (Quasi-Distributed Thin Film MicroStrip) line. First, the characteristics of the QD-TFMS line are obtained by simulation and the size reduction effect is verified. Further, miniaturization of the branch-line hybrid circuit using the QD-TFMS lines is discussed. It is demonstrated that the fabricated circuit can be miniaturized to an area ratio of less than 20% in comparison with a branch-line hybrid circuit using only meander-like lines.

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Three-dimensional passive circuit technology for ultra-compact MMICs

Cited by 62 publications

References 6 publications

Review of radio frequency microelectromechanical systems technology

Review of radio frequency microelectromechanical systems technology

Transmission lines and passive elements for multilayer coplanar circuits on silicon

Miniaturized branch‐line hybrid circuit using 3D MMIC quasi‐distributed TFMS lines

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