1995
DOI: 10.1109/22.475644
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Three-dimensional passive circuit technology for ultra-compact MMICs

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Cited by 62 publications
(10 citation statements)
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“…In recent years, however, Japanese industry has been pioneering ways of increasing levels of integration. For example, NTT developed an ultra-compact 3-D passive circuit technology [5] and also its 'master-slice' technology [6]. With the former, 10 mm vertical gold walls and microwires have been constructed in air.…”
Section: Multilayermentioning
confidence: 99%
“…In recent years, however, Japanese industry has been pioneering ways of increasing levels of integration. For example, NTT developed an ultra-compact 3-D passive circuit technology [5] and also its 'master-slice' technology [6]. With the former, 10 mm vertical gold walls and microwires have been constructed in air.…”
Section: Multilayermentioning
confidence: 99%
“…As a material with mature technology, silicon is increasingly used for higher frequencies as well, both on standard silicon (5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20) cm) as well as on high-resistivity silicon ( 1000 cm) [1], [2], [17].…”
Section: Onolithic Microwave Integrated Circuits (Mmic's)mentioning
confidence: 99%
“…Very complicated three-dimensional multilayer structures have been shown using several polyimide and metallization layers [5].…”
Section: Onolithic Microwave Integrated Circuits (Mmic's)mentioning
confidence: 99%
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“…The three-dimensional MMIC has a multilayered thin-film structure in which dielectrics such as polyimide are stacked on a GaAs or Si substrate; it is highly effective for increasing the degree of integration [6][7][8][9][10]. When active devices and passive devices are formed on different layers in the multilayered configuration, the efficiency of area use can be improved substantially.…”
Section: Introductionmentioning
confidence: 99%