Three-Dimensional Integration of Silicon Chips for Automotive Applications

Weber, W.

doi:10.1557/proc-0970-y03-01

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Manufacturing Process Flow1

D Ic-stacking Using Through-si Vias (Tsvs)1

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2008

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Cited by 3 publications

(2 citation statements)

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“…ICs can be stacked via wafer-to-wafer [17], chip-to-wafer [18] or chip-to-chip [19,20] bonding. Wafer-to-wafer bonding potentially gives the highest throughput among the three, as only one bonding process is required to bond all the chips on a wafer.…”

Section: Manufacturing Process Flowmentioning

confidence: 99%

Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration

Sasangka¹

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Section: Manufacturing Process Flowmentioning

confidence: 99%

Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration

Sasangka¹

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“…An IC-stack can be done either at wafer-to-wafer [42], chip-to-wafer [43,44] or chip-to-chip [45,46] level. Wafer-level processing oers the most cost advantage,…”

Section: D Ic-stacking Using Through-si Vias (Tsvs)mentioning

confidence: 99%

Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits

Riko¹

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During my stay in NTU, I had the previlege of working with some brilliant minds. I would rst like to thank my thesis advisor, Professor Gan Chee Lip, for accepting this novice researcher in his group and providing me with all the tools and the intellectual freedom to pursue the projects of my interest. Essentially, he had taught me how to perform research. I am greatful to Prof. Pey Kin Leong and Prof. Carl Thompson for the stimulating discussions and their valuable comments on the project. I am also greatful to my thesis committee members, Prof. Chen Zhong and Prof. Wong Chee Cheong, who have provided valuable key inputs in the early stage of my research as well as for the desertation. A very special thank to Prof Boey and Prof Subbu for their warm support for my PhD research in MSE I acknowledge the contributions from all my collaborators, especially Dr Yang Liling, Dr Yoon Seung Wook and Prof. Lee Chengkuo whom had been providing time and guidance during my two years attachment in IME. Some of the key results in this thesis will not be possible without fabrication capability of IME. Several research sta have helped me with my experiments over the course of this work. I am indebted to Mastura Aidel, Heryani Binte Ahmad, Sandy Leong, whom had made the use to be Microelectronics lab to be more alive. I would like to thank Eric Tan Jok Boon whom keeping a watchful eye in MRC lab. I also acknowledge the help from Mr Lim Poh Chong from IMRE in using XRD. I am thankfull to all my fellow in MicroE grad-room, whom I have shared many scientic and philosophical conversation over the years. In particullar, Wardhana A. Sasangka and Mr.

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