Thin Films—Interdiffusion and Reactions

Abstract

state materials that involve electronic conductivity. However, Chap. 7 does cover the electrochemistry of mixed ionic-electronic conduction where the electronic conductivity component can vary from very low to very high. An interesting formula index shows that halogen/oxide compounds are of dominant interest with particular emphasis on sodium aluminates and Compounds of copper, lithium, and silver. There is a good chapter on the theoretical aspects of solid electrolytes which sets the tone for the subsequent four chapters which deal with specific materials, e.g.,/~-aluminas, halogenides. The chapters are well referenced covering the literature through 1976. For a small book of 226 pages, there is a lot of information which will be of substantial help to workers in this field.

Mathematical model of electrochemical gas sensors with distributed temporal and spatial parameters and its transformation to models of the real YSZ-based sensors

“…In our case, the dissociative form of adsorption dominates for the oxygen sensor working at temperatures of 700-900°C, and consequently, the adsorption isotherm differs from the linear Langmuir adsorption isotherm [35,36].…”

“…However, considering the assumptions to the mathematical model given above, these flows can be ignored [36].…”

An HREM study of defects at the Pd2Si/Si(111) interface

“…In the present work, we have made direct observation of the Pd,Si/Si( 1 11) epitaxial interface by means of HREM viewed on cross-sectional sFcimcns (Sheng and Chang 1976). The interface is rather wavy with a peak-to-peak distance of about 15nm.…”

“…Some systematic research works on the properties and mechanism of silicide-silicon contacts have already been published (Poate, Tu and Mayer 1978, Tun& Poate, Bean, Gibson and Jacobson 1982). It has been shown that the structure of silicide-silicon epitaxial interfaces has great influence on the electrical properties of the contact.…”

Interfacial interaction of solid nickel with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys

“…[1][2][3][4][5][6][7][8]). It is of interest to investigate the reaction and bonding of a Pb-free solder with various metals, such as nickel, which is widely used as a material for different applications, in microelectronic devices in particular [9][10][11][12].…”