Interfacial interaction of solid nickel with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

“…If soluble, the solid substance dissolves into the liquid phase. In such a case, the dissolution process affects the growth kinetics of the compound layer(s) at the solidliquid interface [38][39][40][41].…”

“…According to the literature, the chemical reaction-controlled (linear) growth kinetics are observed with thin compound layers up to about 500-600 nm and diffusion-controlled (parabolic) growth are characteristic of much thicker compound layers (1 lm or more) [38,39]. The time-thickness relationship is linear in chemical reaction-controlled and it is parabolic in diffusion-controlled stage.…”

“…In this article, a different model, which was developed by Dybkov [35][36][37][38][39][40][41][42][43] for solid-solid interaction condition, is modified for a case of two different IMC compounds and solid-liquid interaction of IMC with liquid solder to evaluate the kinetics constants of IMC growth. It relies on the assumption that the growth of any IMC layer at the interface between two materials A and B at a given temperature is a result of counter-diffusion of components A and B across its bulk followed by partial chemical reactions between diffusing atoms of one component and surface atoms of another component [35][36][37][38][39][40][41][42][43].…”

“…It relies on the assumption that the growth of any IMC layer at the interface between two materials A and B at a given temperature is a result of counter-diffusion of components A and B across its bulk followed by partial chemical reactions between diffusing atoms of one component and surface atoms of another component [35][36][37][38][39][40][41][42][43]. This model is able to reveal the role of diffusion and chemical reactions in determining the IMC layer growth kinetics.…”

Metal-Metal Bonding Process Using Ag₂O/CuO Mixed Particles

“…The use of Pb is showing a tendency to be limited because of its toxicity for living bodies. From this view point, a recent study on the fillers focuses on Pb-free alloys [2,3]. Electrical devises are required to be miniaturized, and to act with high-power.…”