IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

Abdelhadi, Ousama M.; Ladani, Leila

doi:10.1016/j.jallcom.2012.04.068

Cited by 106 publications

(19 citation statements)

References 40 publications

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“…However, during soldering reflow process, the growth of IMC layers is quite complex. Some researchers reported 9 the IMC growth kinetics to be governed by grain boundary (GB) diffusion and volume diffusion process [10,13,[23][24][25]. It was found in literature that if the n value is close to 0.33, then the IMC growth kinetics is governed by grain boundary diffusion [23], while n=0.5 dictates that it is volume diffusion which controls the IMC growth [24].…”

Section: Imc Layer Growth Behaviormentioning

confidence: 99%

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Choudhury

Ladani

2016

Journal of Alloys and Compounds

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Current trend in miniaturization of microelectronic devices is the motivating factor for size reduction of joints and interconnects. The electronic industry is expecting to reduce the scale of interconnects in the next generations microelectronic devices. Mechanical behavior of these joints will significantly be different from traditional solder joints due to the effects such as geometrical and microstructural constraints, anisotropy caused by the reduction in a number of grains, and the presence of brittle intermetallics (IMCs). Mechanical experiments at this scale are very challenging. This study was focused on investigating the effect of different volume fraction of IMCs on the shear behavior of micro-scale solder joints with a 50µm stand-off height. A single lap-shear specimen was designed to conduct the study. Two Copper (Cu) substrates were soldered together with Sn-3.5Ag solder foil and a thickness of 50µm was achieved. The soldering temperature of 260°C and soldering time of 10, 30 and 60 minutes were utilized to achieve approximately 40%, 60% and 80% IMCs of total joint thickness. The experiments were conducted using a micro-tensile tester which is integrated with an optical microscope for monitoring and observing deformation in the testing materials. To investigate the local shear strain behavior, an optical technique along with a developed image processing computer program was used. The single lap-shear tests were conducted with the shear strain rate of 0.015s -1 and 0.15s -1 to observe

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Section: Imc Layer Growth Behaviormentioning

confidence: 99%

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Choudhury

Ladani

2016

Journal of Alloys and Compounds

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“…However, large volume fraction of Ag3Sn intermetallic compound (IMC) and its fast reaction rate with the metallization layer is still the main drawback of the SAC solders [3]. The formation and growth of the IMC layer is more rapid in SAC solder joints than it was in lead contain alloys, and it results in not only brittle fractures but also reduces the thermal fatigue life of the joints [4]. One of the recent approach, which can address this issue is to develop a nano-composite solders with the incorporation of a small amount of metallic or ceramic nanoparticles into the SAC solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Nasir

Yahaya

Erer

et al. 2019

Ceramics International

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The improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt. % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt. % TiO2 nanoparticles improved the hardness values up to 26.2 % than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples.

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“…The IMCs between Sn-based solder and Cu are mainly Cu 6 Sn 5 and Cu 3 Sn, which will gradually grow and thicken with the service time. Due to the embrittlement of IMCs, solder joints are prone to brittle fracture due to excessive growth of IMCs during service, which deteriorates the reliability of solder joints [13]. Therefore, various methods were used to inhibit the excessive growth of IMCs.…”

Section: Introductionmentioning

confidence: 99%

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

2019

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Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

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IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

Cited by 106 publications

References 40 publications

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

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