Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Abstract

The improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt. % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt. % TiO2 nanoparticles improved the hardness values up to 26.2 % than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples.

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

“…As increased nucleation sites (correlated to the increment of the peak intensities) induced finer phase formation, it can be noted that the ZnO NPs also favoured the formation of finer β-Sn and Ag 3 Sn IMCs. This could be the reason for the higher β-Sn and Ag 3 Sn peak intensities observed on the (SAC355) 99.9 (ZnO) 0.1 , (SAC355) 99.7 (ZnO) 0.3 and (SAC355) 99.3 (ZnO) 0.7 samples (Mohd Nasir et al , 2019). Besides the peaks of the tin phase, a peak accompanied by ZnO NPs was observed in the solder systems containing 0.5, 0.7 and 1.0 Wt.% ZnO NPs.…”

“…As shown in Table 3, the increment could be attributed to the stiffness of the IMC phases in the Sn matrix, as well as the irregularities caused by the agglomeration of ZnO NPs. However, ZnO NPs dispersed uniformly in the Sn matrix may improve the hardness properties significantly over the base alloy (Mohd Nasir et al , 2019; Ma et al , 2017). Figure 6(b) demonstrates a typical strain curve; here the strain is defined in this case as the percentage change in the area given by (Δ S / S o ), where Δ S = S − S o and S o is the area at the shortest indentation time (Shalaby et al , 2018).…”

The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint

“…However, compared with traditional Sn-Pb solder, Sn-Ag-Cu solder still has some disadvantages [4][5][6][7]. For nanocomposite solders, nanoparticles can fix the grain boundaries, prevent grain boundaries from sliding, and increase the diffusion energy of grain boundaries, thereby improving the creep resistance of the alloy and improving the reliability of the solder [8][9][10][11][12]. With the continuous maturity of nanotechnology, the modification of solder by adding nanoparticles may be an important research direction in the future.…”

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

“…Since the reliability of the solder joints mainly depends on the ability of the solder alloy to withstand deformation, the mechanical properties have received significant attention. A novel lead-free solder should possess excellent mechanical properties to meet the reliability requirements of the electronic industry [ 9 , 10 , 11 ]. Therefore, it is advisable to further improve the mechanical properties of the Sn-Zn solder.…”