Thickness dependence of resistivity for Cu films deposited by ion beam deposition

Lim, Joo Won; Mimura, Kouji; Isshiki, Minoru

doi:10.1016/s0169-4332(03)00522-1

Cited by 93 publications

(52 citation statements)

References 8 publications

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“…On the evaluation of the resistivity, the size effect does not work on the resistivity so much when the thickness is above 100 nm even though the grain size is increasing with the film thickness. 10,13) Therefore, it is believed that the increased thickness of Cu film does not clearly affect the resistivity of the Cu film in this study. On the other hand, the high value of the Cu film resistivity at lower sputtering power is attributed to the structural defects such as low density and crystallinity due to the low surface mobility.…”

Section: )mentioning

confidence: 81%

“…[1][2][3] Thin films of Cu are deposited by various techniques such as evaporation, sputtering, chemical vapor deposition, electroplating, and ion beam deposition. [4][5][6][7][8][9][10][11] Among these techniques, direct current (DC) magnetron sputtering is one of the best methods for practical preparation of Cu films. Since DC magnetron sputtering technique has the advantage of much better productivity than other deposition methods, it is widely used as mass production processes.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Sohn

Lim

et al. 2010

Mater. Trans.

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Cu thin films were deposited on Si(100) substrates using direct current (DC) magnetron sputtering. We focused on the effect of sputtering DC power on the electrical, structural properties, and the nucleation and growth of Cu films during the initial stage of sputtering. The Cu films deposited at higher sputtering power showed strong crystallinity, low electrical resistivity in comparison with the Cu films deposited at lower sputtering power. Concerning the nucleation and growth of Cu films during initial stage of magnetron sputtering, it was found that the progress of the nucleation and growth of the Cu films at higher sputtering is much faster than those of the Cu films at lower sputtering power even though they have a similar nucleation and growth mechanism, and their relation to resultant microstructure was confirmed by atomic force microscopy.

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Section: )mentioning

confidence: 81%

Section: Introductionmentioning

confidence: 99%

Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Sohn

Lim

et al. 2010

Mater. Trans.

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“…Another factor is the effect of electron scattering on surfaces and grain boundaries, of surface roughness and of island growth on electrical conductivity for different other metals such as copper, silver or gold were evaluated by [101][102][103][104][105][106][107][108][109][110][111][112][113][114][115][116][117][118][119] and fitted to models of Fuchs [120], Sondheimer [121], Soffer [122], Namba [107], Mayadas, and Shatzkes [123,124].…”

Section: Electrical Surface Resistance: Practical Aspects and Analysesmentioning

confidence: 99%

Thickness Measurement Methods for Physical Vapor Deposited Aluminum Coatings in Packaging Applications: A Review

Lindner

Schmid

2017

Coatings

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Abstract:The production of barrier packaging materials, e.g., for food, by physical vapor deposition (PVD) of inorganic coatings such as aluminum on polymer substrates is an established and well understood functionalization technique today. In order to achieve a sufficient barrier against gases, a coating thickness of approximately 40 nm aluminum is necessary. This review provides a holistic overview of relevant methods commonly used in the packaging industry as well as in packaging research for determining the aluminum coating thickness. The theoretical background, explanation of methods, analysis and effects on measured values, limitations, and resolutions are provided. In industrial applications, quartz micro balances (QCM) and optical density (OD) are commonly used for monitoring thickness homogeneity. Additionally, AFM (atomic force microscopy), electrical conductivity, eddy current measurement, interference, and mass spectrometry (ICP-MS) are presented as more packaging research related methods. This work aims to be used as a guiding handbook regarding the thickness measurement of aluminum coatings for packaging technologists working in the field of metallization.

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“…Let's now try to verify the role of the grains finite size on the resistivity. First, we can test the influence of the surface scattering effects on the thickness dependence of the resistivity using the Fuch-Sondheimer model [19,20].…”

Section: Electrical Behaviormentioning

confidence: 99%

Microstructural, electrical and magnetic properties of Fe35Co65 thin films grown by thermal evaporation from mechanically alloyed powders

et al. 2014

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We present a detailed study of the microstructural, electrical and magnetic properties of Fe 35 Co 65 thin films deposited by thermal evaporation using nanocrystalline mixture. The nanocrystalline Fe 35 Co 65 powder was prepared by mechanical alloying process using high energy ball milling and then carefully studied. Good homogeneity, purity and stoichiometry were demonstrated in the powder composed of 25 nm mean crystallite size. Microstuctural analysis of Fe 35 Co 65 thin films ranging from 9 to 50 nm deposited on Si (001) shows that the stoichiometry is conserved over the whole thickness range and that (110) texture forms as the film thickness increases. Our work finally demonstrates that high saturation magnetization, low coercivity and high electrical resistivity FeCo thin films can be achieved by thermal evaporation from properly set mechanical alloying powder.

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Thickness dependence of resistivity for Cu films deposited by ion beam deposition

Cited by 93 publications

References 8 publications

Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Thickness Measurement Methods for Physical Vapor Deposited Aluminum Coatings in Packaging Applications: A Review

Microstructural, electrical and magnetic properties of Fe35Co65 thin films grown by thermal evaporation from mechanically alloyed powders

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