Thermal modelling of the emerging multi-chip packages

Monier-Vinard, Eric; Bissuel, Valentin; Murphy, Paul H.; Daniel, Olivier; Dufrenne, Julien

doi:10.1109/esime.2010.5464514

Cited by 7 publications

(4 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It means that the establishment of behavioral models, for system-level analysis, such as Compact Thermal Models (Monier-Vinard et al , 2010), can be performed on a consistent three-dimensional representation.…”

Section: Discussionmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

Self Cite

View full text Add to dashboard Cite

Purpose Latest Computational Fluid Dynamics (CFDs) tools allow modeling more finely the conjugate thermo-fluidic behavior of a single electronic component mounted on a Printed Wiring Board (PWB). A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. The purpose of this study is to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results to assess their relevance. Design/methodology/approach The present study focuses on the case of a Ball Grid Array (BGA) package of 208 solder balls that connect the component electronic chip to the Printed Wiring Board. Its complete geometrical definition has to be coupled with a realistic board layers layout and a fine description of their numerous copper traces to appropriately predict the way the heat is spread throughout that multi-layer composite structure. The numerical model computations were conducted on four CFD software then compare to experiment results. The component thermal metrics for single-chip packages are based on the standard promoted by the Joint Electron Device Engineering Council (JEDEC), named JESD-51. The agreement of the numerical predictions and measurements has been done for free and forced convection. Findings The present work shows that the numerical model error is lower than 2 per cent for various convective boundary conditions. Moreover, the establishment of realistic numerical models of electronic components permits to properly apprehend multi-physics design issues, such as joule heating effect in copper traces. Moreover, the practical modeling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were tested and appeared to be tricky. A new approach based on an effective thermal conductivity matrix is investigated to reduce computation time. The obtained numerical results highlight a good agreement with experimental data. Research limitations/implications The study highlights that the board three-dimensional modeling is mandatory to properly match the set of experiment results. The conventional approach based on a single homogenous layer using effective thermal conductivity calculation has to be banned. Practical implications The thermal design of complex electronic components is henceforth under increasing control. For instance, the impact of gold wire-bonds can now be investigated. The three-dimensional geometry of sophisticated packages, such as in BGA family, can be imported with all its internal details as well as those of its associated test board to build a realistic numerical model. The establishment of behavioral models such as DELPHI Compact Thermal Models can be performed on a consistent three-dimensional representation with the aim to minimize computation time. Originality/value The study highlights that multi-layer copper trace plane discretization could be used to strongly reduce computation time while conserving a high accuracy level.

show abstract

Section: Discussionmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

Self Cite

View full text Add to dashboard Cite

show abstract

“…Then a Genetic Algorithm fitting technique [3] [4][5][6][7][8] allows us to determine the best network candidate that properly matches heat flow rates and temperatures of the realistic model, for all its sensitive parts and its external surfaces.…”

Section: Definition Of Inductor Behavioral Modelmentioning

confidence: 99%

“…The two-sources (S) thermal resistances network, is built from a wide set of DELPHI [4][5][6][7][8] or JEDEC-JESD15-4 [1] boundary conditions (BC), applied successively on all external surfaces of the model, which is completed by the superposition principle; (S number +1) x BC number.…”

Section: Definition Of Inductor Behavioral Modelmentioning

confidence: 99%

See 1 more Smart Citation

Investigation of Delphi compact thermal model style for modeling surface-mounted Soft Magnetic Composite inductor

Monier-Vinard

Bissuel

Dia

et al. 2013

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Self Cite

View full text Add to dashboard Cite

Recent works on System-In-Package component pointed out that its in-package inductor is the hottest part. It occurs that thermal stresses due to joule heating and magnetic losses can be damaging. The present study focuses on low profile, surface-mounted, Soft Magnetic Composite inductors to define their thermal behaviour and then to propose a guideline to create pertinent models. Results highlight the impact of thermal conductivity of composite core on temperatures and the lack of properties data of iron-resin mixtures. Using mixture model, a calculation of effective thermal conductivity is proposed.To minimize the expensive meshing of the fine detailed simulations and the computation time, a novel Compact Thermal Model for inductor, based on DELPHI methodology, was established. The predictions of CTM model show good agreement, less than 10% of divergence. Further works must be done to really master the coupled interaction of magnetic, joule effect, thermal phenomenon as well as material properties.

show abstract