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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2012
DOI: 10.1109/esime.2012.6191720
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Thermal modeling of active embedded chip into high density electronic board

Cheikh Tidiane Dia1,
Eric Monier-Vinard2,
Valentin Bissuel3
et al.
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Cited by 3 publications
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References 11 publications
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Practical steady-state temperature prediction of active embedded chips into high density electronic board

Monier-Vinard
1
,
Rogié
2
,
Nguyen3
et al. 2016
J. Phys.: Conf. Ser.
1
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0
0
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Practical steady-state temperature prediction of active embedded chips into high density electronic board

Monier-Vinard
1
,
Rogié
2
,
Nguyen3
et al. 2016
J. Phys.: Conf. Ser.
1
0
0
0
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Thermal-mechanical simulation of embedded module based on organic substrate

Zhang
1
,
Chan
2
,
Cao
3
et al. 2013
2013 IEEE International Symposium on Advanced Packaging Materials
5
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Three dimensional steady-state temperature prediction of volumetric heating sources embedded into multi-layer electronic board substrate

Rogié
1
,
Monier-Vinard
2
,
Nguyen3
et al. 2017
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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