State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Abstract

Purpose Latest Computational Fluid Dynamics (CFDs) tools allow modeling more finely the conjugate thermo-fluidic behavior of a single electronic component mounted on a Printed Wiring Board (PWB). A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. The purpose of this study is to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results to assess their relevance. Design/methodology/approach The present study focuses on the case of a Ball Grid Array (BGA) package of 208 solder balls that connect the component electronic chip to the Printed Wiring Board. Its complete geometrical definition has to be coupled with a realistic board layers layout and a fine description of their numerous copper traces to appropriately predict the way the heat is spread throughout that multi-layer composite structure. The numerical model computations were conducted on four CFD software then compare to experiment results. The component thermal metrics for single-chip packages are based on the standard promoted by the Joint Electron Device Engineering Council (JEDEC), named JESD-51. The agreement of the numerical predictions and measurements has been done for free and forced convection. Findings The present work shows that the numerical model error is lower than 2 per cent for various convective boundary conditions. Moreover, the establishment of realistic numerical models of electronic components permits to properly apprehend multi-physics design issues, such as joule heating effect in copper traces. Moreover, the practical modeling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were tested and appeared to be tricky. A new approach based on an effective thermal conductivity matrix is investigated to reduce computation time. The obtained numerical results highlight a good agreement with experimental data. Research limitations/implications The study highlights that the board three-dimensional modeling is mandatory to properly match the set of experiment results. The conventional approach based on a single homogenous layer using effective thermal conductivity calculation has to be banned. Practical implications The thermal design of complex electronic components is henceforth under increasing control. For instance, the impact of gold wire-bonds can now be investigated. The three-dimensional geometry of sophisticated packages, such as in BGA family, can be imported with all its internal details as well as those of its associated test board to build a realistic numerical model. The establishment of behavioral models such as DELPHI Compact Thermal Models can be performed on a consistent three-dimensional representation with the aim to minimize computation time. Originality/value The study highlights that multi-layer copper trace plane discretization could be used to strongly reduce computation time while conserving a high accuracy level.

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

“…Table 3 gives the adjusted thermal properties of the calibrated numerical model of the board substrate. Numerical simulations were performed using four distinct pieces of computational fluid dynamic software [1,19] and demonstrates, whatever the thermal test board, a very good agreement between the experimental measurements and numerical results on the R JA computation, as reported in Table 4, for the 2s2p PCB. It occurs that the discrepancy of the numerical model (R N JA ) in comparison to measurements (R M JA ) is lower than 2%.…”

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

“…On the other hand, the numerical modelling of a fine three-dimensional representation of complex multiple heating sources package is today easier as well as Printed Circuit Board on which it is mounted [3]. That accurate modelling allows a new way to calibrate the thermal behaviour of a component from experiment and then derive an appropriate thermal network.…”

“…Those surrogate models have the benefits of correctly predicting the thermal path of the packages, within a good tolerance, without the need for a full geometry description. objective function (3). Its form is expressed as a weighted-sum equation:…”