Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Abstract

Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI dynamical CTM (DCTM), based on model order reduction (MOR) were developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is proposed. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied, at first on a single-chip package (QFN16) then on a dual-chip package (DFN12). Their derived CTM and DCTM have been compared in term of accuracy and creation time using, or not, MOR reduction technique. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and consequently reduce the thermal network creation time by 80%.

Optimized design of battery pole control system based on dual-chip architecture

“…The dual-chip architecture separates the parts that are prone to interfere with each other, which can effectively reduce noise and improve the resolution of the sensor [ 21 ], at the same time, Brice.R et al . [ 22 ], used a model reduction method to analyze the heat dissipation problem of the dual-chip architecture and experimentally verified that the dual-chip architecture can reduce the thermal network creation time by 80%. Therefore, the dual-chip architecture has stronger thermal and immunity capabilities and is more suitable for high-speed mechanical platforms.…”

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

“…As seen in Figure 8, the chip is now partitioned in nine zones (2 9 possible combinations) to model more accurately the heating due to the individual activation of various logical functions. The largest source and the smallest one represent respectively 22.4% and 1.8% of the chip volume.…”

“…The reduced model is obtained by reducing the initial base by the amalgam method [7]. These developments gave birth to a new hybrid methodology to build DELPHI-inspired DCTMs by replacing the full detailed models by a reduced-order model based on the modal approach [8,9]. However, more complex configurations demand more sophisticated methods, in which simple reduced models are built and then connected to each other.…”

“…A single component with independent multiple heat sources has also been recently considered using the MPMM method [9] or AROMM [13]. Those studies have been limited to a component with a couple of independent sources.…”

Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

“…Krylov subspace-based MOR techniques have been utilised for thermal analysis of an electric converter assembly by Liu et al [7]. Thermal boundary condition independency of Krylov subspace-based reduced order modelling approach has been examined for thermal and coupled thermal analysis by Rogié et al [8] and Codecasa et al [9,10].…”