Thermal Conductivity of Polymers and Their Nanocomposites

Xu, Xiangfan; Chen, Jie; Zhou, Jun; Li, Baowen

doi:10.1002/adma.201705544

Cited by 518 publications

(336 citation statements)

References 146 publications

Supporting

Mentioning

309

Contrasting

Order By: Relevance

“…The filler, as an additive to increase the thermal conductivity, is also crucial in controlling thermal conductivity of composite. Most of the researches on low filler content composites are focused on the percolation network of filler, in which the fillers within matrix are connected and creates pathway for phonon or electron to easily transfer the heat 217,223 . When the percolation network exists within the matrix, the thermal conductivity is exponentially increased, which usually occurs around 10-20 wt% of conductive filler 223 .…”

Section: Thermal and Electrical Conductivitymentioning

confidence: 99%

Polymer nanocomposites having a high filler content: synthesis, structures, properties, and applications

et al. 2019

View full text Add to dashboard Cite

The recent development of nanoscale fillers, such as carbon nanotube, graphene, and nanocellulose, allows the functionality of polymer nanocomposites to be controlled and enhanced. However, conventional synthesis methods of polymer nanocomposites cannot maximise the reinforcement of these nanofillers at high filler content. Approaches to the synthesis of high content filler polymer nanocomposites are suggested to facilitate future applications. The fabrication methods address design of the polymer nanocomposite architecture, which encompass one, two, and three dimensional morphology. Factors that hamper the reinforcement of nanostructures, such as alignment, dispersion of filler as well as interfacial bonding between filler and polymer are outlined. Using suitable approaches, maximum potential reinforcement of nanoscale filler can be anticipated without limitations in orientation, dispersion, and the integrity of the filler particle-matrix interface. High filler content polymer composites containing emerging materials such as 2D transition metal carbides, nitrides, and carbonitrides (MXenes) are expected in the future.Graphical abstract: Approaches to the synthesis of high filler content polymer composites

show abstract

Section: Thermal and Electrical Conductivitymentioning

confidence: 99%

Polymer nanocomposites having a high filler content: synthesis, structures, properties, and applications

et al. 2019

View full text Add to dashboard Cite

show abstract

“…However, thermal conductivity of most polymers is very low, which might lead to serious problems for device applications such as heat dissipation failure, especially for the organic electronic devices. Previous studies have shown that the low thermal conductivity in polymers mainly comes from the amorphous structures and weak interchain interactions . Therefore, in order to tailor the heat conduction in conductive polymers, it is of great importance to understand the thermal transport mechanisms in conductive polymers.…”

Section: Introductionmentioning

confidence: 99%

“…Previous studies have shown that the low thermal conductivity in polymers mainly comes from the amorphous structures and weak interchain interactions. [21][22][23] Therefore, in order to tailor the heat conduction in conductive polymers, it is of great importance to understand the thermal transport mechanisms in conductive polymers.…”

mentioning

confidence: 99%

Thermal Transport in Conductive Polymer–Based Materials

Zhou

Chen

2019

Adv Funct Materials

Self Cite

152

106

View full text Add to dashboard Cite

The demand for flexible conductive materials has motivated many recent studies on conductive polymer–based materials. However, the thermal conductivity of conductive polymers is relatively low, which may lead to serious heat dissipation problems for device applications. This review provides a summary of the fundamental principles for thermal transport in conductive polymers and their composites, and recent advancements in regulating their thermal conductivity. The thermal transport mechanisms in conductive polymer–based materials and up‐to‐date experimental approaches for measuring thermal conductivity are first summarized. Effective approaches for the regulation of thermal conductivity are then discussed. Finally, thermal‐related applications and future perspectives are given for conductive polymers and their composites.

show abstract

“…In order to maintain performance and reliability of electronic devices, it is of great importance for the heat generated by billions of tiny transistors during operation to be efficiently dissipated as soon as possible. Consequently, manufacturing electronic packaging or supporting materials with high thermal conductivities to cool down electronic devices is an essential prerequisite …”

Section: Introductionmentioning

confidence: 99%

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

View full text Add to dashboard Cite

Dielectric polymer‐based composites with high breakdown strengths and thermal conductivities have attracted considerable attention when applied in electronic devices. In this study, a novel poly(m‐phenyleneisophthalamide) (PMIA) dielectric nanocomposite is successfully fabricated by introducing functionalized hexagonal boron nitride nanosheet (fBNNS) fillers. Due to effective functionalization of hexagonal boron nitride nanosheets (BNNSs), fBNNSs fillers are homogeneously dispersed in the PMIA matrix. The breakdown strength and thermal conductivity of PMIA/fBNNSs dielectric nanocomposite are investigated. Research results indicate that the breakdown strength of fBNNSs‐12 reaches 105.6 MV m−1, which is 1.34 times that of pure PMIA. Moreover, owing to high thermal conductivity of fBNNSs, the thermal conductivities of fBNNSs‐12 are observably increased to 8.06 W m−1 K of in‐plane direction and 0.84 W m−1 K of through‐plane direction, respectively. Considering these properties, the manufactured PMIA/fBNNSs dielectric nanocomposites show potential applications in field of electronics.

show abstract

Thermal Conductivity of Polymers and Their Nanocomposites

Cited by 518 publications

References 146 publications

Polymer nanocomposites having a high filler content: synthesis, structures, properties, and applications

Polymer nanocomposites having a high filler content: synthesis, structures, properties, and applications

Thermal Transport in Conductive Polymer–Based Materials

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Contact Info

Product

Resources

About