2019
DOI: 10.1002/adfm.201904704
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Thermal Transport in Conductive Polymer–Based Materials

Abstract: The demand for flexible conductive materials has motivated many recent studies on conductive polymer–based materials. However, the thermal conductivity of conductive polymers is relatively low, which may lead to serious heat dissipation problems for device applications. This review provides a summary of the fundamental principles for thermal transport in conductive polymers and their composites, and recent advancements in regulating their thermal conductivity. The thermal transport mechanisms in conductive pol… Show more

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Cited by 138 publications
(93 citation statements)
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References 195 publications
(275 reference statements)
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“…This value is comparable with the other values reported for 2D and 3D MOFs and conductive polymers. [ 21,29–33 ] The contribution from κnormale is proportional to σ (Wiedemann–Franz law) and is, in general, one or two orders of magnitude larger than κnormalp in electrically conductive materials. [ 34 ] Though the device structure of the thermal conductivity measurement prevented us from measuring the electrical conductivity on the same sample, we can deduce that κnormale is negligible compared with κnormalp, considering that the measured thermal conductivity is already close to the theoretical limit of phonon thermal conductivity: the minimum of the phonon mean free path is twice the interatomic distance.…”
Section: Resultsmentioning
confidence: 99%
“…This value is comparable with the other values reported for 2D and 3D MOFs and conductive polymers. [ 21,29–33 ] The contribution from κnormale is proportional to σ (Wiedemann–Franz law) and is, in general, one or two orders of magnitude larger than κnormalp in electrically conductive materials. [ 34 ] Though the device structure of the thermal conductivity measurement prevented us from measuring the electrical conductivity on the same sample, we can deduce that κnormale is negligible compared with κnormalp, considering that the measured thermal conductivity is already close to the theoretical limit of phonon thermal conductivity: the minimum of the phonon mean free path is twice the interatomic distance.…”
Section: Resultsmentioning
confidence: 99%
“…Heat conducting materials mediate between the heating device and heat radiation material to transfer the heat. Polymer composites containing heat conducting fillers have attracted significant attention for applications in heat conducting materials because of their light‐weight, flexibility, and easy‐processability . Various materials such as carbons, metals, and inorganic particles have been reported as heat conducting fillers that are blended into the matrix of thermo‐plastic or thermo‐setting polymer.…”
Section: Introductionmentioning
confidence: 99%
“…Polymer composites containing heat conducting fillers have attracted significant attention for applications in heat conducting materials because of their light-weight, flexibility, and easy-processability. [2][3][4][5][6][7] Various materials such as carbons, metals, and inorganic particles have been reported as heat conducting fillers that are blended into the matrix of thermo-plastic or thermo-setting polymer. When granular thermally conductive materials are used as fillers, the composite sheet exhibits isotropic thermal conductivity.…”
mentioning
confidence: 99%
“…On the other hand, the thermal transport property is crucial for the performance and reliability of various devices, which can have promising applications in both thermal management and thermoelectric devices (Shi et al, 2012;Alva et al, 2018;Hu et al, 2018;Xie et al, 2018;Ouyang et al, 2019;Zhu et al, 2019;Xu et al, 2020;Zhang et al, 2020a;Zhang et al, 2020b). Especially the materials with high thermal conductivity and excellent mechanical properties are of great importance in solving the heat dissipation problem of highly integrated electronic devices (Ghosh et al, 2008).…”
Section: Introductionmentioning
confidence: 99%