Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors

Nicolics, J.; Mundlein, M.; Hanreich, G.; Zluc, Andreas; Stahr, Hannes; Franz, Manuela

doi:10.1109/isse.2007.4432819

Cited by 3 publications

(2 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Similar investigations were described in other works Kłossowicz et al, 2012;Nicolics et al, 2007). The motivation to undertake this study was to compare the performance of embedded components to standard ones assembled in surface mount technology.…”

Section: Introductionmentioning

confidence: 81%

See 1 more Smart Citation

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

et al. 2014

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to investigate the thermal behaviour of thin-and thick-film resistor with different dimensions and contacts embedded into printed circuit board (PCB) and compare them to the similar constructions of discrete chip resistors assembled to standard PCBs. Design/methodology/approach -In investigations the thin-and thick-film embedded resistors with the bar form in different dimensions and configurations of contacts as well as rectangular chip resistors in package 0603 and 0402 were used. In tests were carried out the measurements of dissipated power in temperature of resistor about 408C, 708C and 1558C. The power dissipation was calculated as a multiplying of electrical current flowing through the resistor with voltage across the resistor. The dissipation of heat generated by electrical current flowing through resistors was examined by means of the FLIR A320 thermographic camera with lens Closeup £ 2 and the power source. Findings -The results show that, in case of chip resistors, the intensity of heat radiation strongly depends on dimensions of copper contact lands and also depends on the dimensions of the resistor. In case of embedded resistors, with comparable dimensions to chip resistors, they have lower ability to power dissipation, as well as the copper contact lands dimensions have lower influence. The thermal radiation through resin material is not as effective as it is in case of resistors assembled on PCB. However, the embedded thick-film resistors, especially made of paste Minico M2010, have already the similar parameters to 0402 chip resistors. Research limitations/implications -Research shows that embedded resistors can be used interchangeably with SMD resistors it allows to open up space on the surface of PCB, but it should be taken into account the lower energy dissipation capabilities. It is suggested that further studies are necessary for accurately determining the thermal effects and investigate the structures of embedded passive components that allow for better heat management. Originality/value -Thermal stability of embedded resistors during operation is a critical factor of success of embedded resistor technology. The way of power dissipation and heat resistance are one of the important operating parameters of these components. The results provide information about the power and the energy dissipation of embedded thin-and thick-film resistors compared to the standard surface mount technology.

show abstract

Section: Introductionmentioning

confidence: 81%

“…Also, because thermography is based on a radiation measurement of the whole observed area, its emissivity must be known. At this point it should be noted that coating with a black layer helped to increase the measurement accuracy (Nicolics et al, 2007). The measurements were carried out in …”

Section: Methodsmentioning

confidence: 99%

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

et al. 2014

View full text Add to dashboard Cite

show abstract

A substrate integrated matched load with embedded resistive thick film

Rave

Jacob

2016

2016 IEEE MTT-S International Microwave Symposium (IMS)

View full text Add to dashboard Cite

Implementation of mathematical model of thermal behavior of electronic components for lifetime estimation based on multi-level simulation

Frivaldský¹,

Pridala²,

Drgoňa³

2017

Archives of Electrical Engineering

View full text Add to dashboard Cite

Abstract:The main purpose of the paper is the proposal of multi-level simulation, suited for the evaluation of the lifetime of critical electronic devices (electrolytic capacitors). The aim of this issue is to imagine about the expected operation of complex and expensive power electronic systems, when the failure of the most critical component occurs. For that reason, various operational conditions and various physical influences must be considered (e.g. mechanical, humidity, electrical, heat stress), where nonlinearities are naturally introduced. Verification of the proposal is given, whereby the life-time estimation of an electrolytic capacitor operated in a DC-DC converter during various operational conditions is shown. At this point electrical and heat stress is considered for lifetime influence. First, the current state in the field of mathematical modeling of the lifetime for electrolytic capacitors, considering main phenomena is introduced. Next, individual sub-models for multi-level simulation purposes are developed, including a thermal simulation model and electrical simulation model. Several complexities of individual models are mutually compared in order to evaluate their accuracy and suitability for further use. Proper simulation tools have been mutually linked and data transfer was secured, in order to have the possibility of investigation of a lifetime depend on the changes of various variables.

show abstract

Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors

Cited by 3 publications

References 4 publications

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

A substrate integrated matched load with embedded resistive thick film

Implementation of mathematical model of thermal behavior of electronic components for lifetime estimation based on multi-level simulation

Contact Info

Product

Resources

About