The Road to Affordable, Large-Scale Silicon Photonics

Streshinsky, Matthew; Ding, Ran; Liu, Y.; Novack, Ari; Galland, Christophe; Lim, Andy Eu-Jin; Lo, Patrick; Baehr‐Jones, Tom; Hochberg, Michael

doi:10.1364/opn.24.9.000032

Cited by 88 publications

(46 citation statements)

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“…The details of the platform is provided in [11]. The system integrates all the equalization functionalities as well as optical to electrical conversion in one chip, hence, it can be viewed as a self-equalizing photodetector (SEPD).…”

Section: Design and Implementationmentioning

confidence: 99%

Self-equalizing photodiodes, a hybrid electro-optical approach to tackle bandwidth limitation in high-speed signaling

Abiri¹,

Aflatouni²,

Hajimiri³

2017

Opt. Express

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Section: Design and Implementationmentioning

confidence: 99%

Self-equalizing photodiodes, a hybrid electro-optical approach to tackle bandwidth limitation in high-speed signaling

Abiri¹,

Aflatouni²,

Hajimiri³

2017

Opt. Express

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“…The last decade has seen Si-photonics promoted as a platform for potentially revolutionary advances in the fields of Telecommunications, Data Communications, Medical Technology, Security, and Sensing [1][2][3]. The main driving force behind Si-photonics is the potential to realize small, highly integrated, photonic sub-systems that leverage off the decades of fabrication experience, technology, and scalability already developed for CMOS (complementary metal-oxide semiconductor) electronics [4].…”

Section: Introductionmentioning

confidence: 99%

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

et al. 2016

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Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.

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“…Integrated Photonics, and in particular, silicon photonics, is rapidly enabling complex photonic functions on a chip [1]. However, variability due to fabrication processes and operational conditions limits the complexity of the circuits that can be implemented [2,3].…”

Section: Introductionmentioning

confidence: 99%

Stochastic collocation for device-level variability analysis in integrated photonics

Xing¹,

Spina²,

Li³

et al. 2016

Photon. Res.

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We demonstrate the use of stochastic collocation to assess the performance of photonic devices under the effect of uncertainty. This approach combines high accuracy and efficiency in analyzing device variability with the ease of implementation of sampling-based methods. Its flexibility makes it suitable to be applied to a large range of photonic devices. We compare the stochastic collocation method to a Monte Carlo technique on a numerical analysis of the variability in silicon directional couplers.

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The Road to Affordable, Large-Scale Silicon Photonics

Cited by 88 publications

References 0 publications

Self-equalizing photodiodes, a hybrid electro-optical approach to tackle bandwidth limitation in high-speed signaling

Self-equalizing photodiodes, a hybrid electro-optical approach to tackle bandwidth limitation in high-speed signaling

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Stochastic collocation for device-level variability analysis in integrated photonics

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