The reliability of lead-free solder joint subjected to special environment: a review

Wang, Jianhao; Xue, Songbai; Zhang, Peng; Zhai, Peizhuo; Yu, Tao

doi:10.1007/s10854-019-01333-w

Cited by 48 publications

(19 citation statements)

References 141 publications

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“…Sn-based solder alloys with excellent properties are widely used in electronic packaging, and a few novel Sn-based solder alloys that are applied in the packaging of integrated circuits (IC) have been designed to meet the rising requirement of electrical devices, thanks to the researchers [4][5][6]. Recently, owing to the development of electronics industry, the high-density packaging technologies for integrated circuits (IC), such as BGA, CSP, IGBT, and WLP, have been applied gradually, promoting the upgrading and miniaturizing process of electrical products [7,8]. But miniaturization of ICs with higher power also results in increasingly higher service temperature of more than 300 °C, which puts much emphasis on the electrical devices as well as their packaging materials [9].…”

Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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“…Sn-Ag-Cu solder is the best substitution in the replace of Sn-Pb solder. However, with the miniaturization of electron components and deterioration of the service environment, the higher requirements are put forward for the comprehensive properties of SAC solders [62][63][64]. Therefore, lots of measures had been carried out to enhance the comprehensive performance of SAC solders.…”

Section: Evolution Of Microstructure and Propertiesmentioning

confidence: 99%

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Wang

Liu

et al. 2020

Journal of Nanomaterials

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With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

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“…Since the restriction of hazardous substances (RoHS) directive was enforced in the European Union (EU) in 2006, the use of lead-containing solder in electrical and electric equipment has been regulated and thus lead-free solder such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi alloys has been used [ 1 ]. Currently, Sn-Ag-Cu alloys such as Sn-3.0Ag-0.5Cu (mass%) and Sn-3.5Ag-0.7Cu (mass%) are mainly used for the assembly of electronics parts [ 2 , 3 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

et al. 2021

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The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a high-angle grain boundary. An amount of 0.1% proof stress of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at a strain rate of 2.0 × 10−1 s−1. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on tensile strength is negligible at both 25 °C and 175 °C. The elongation of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at 25 °C according to the fracture mode change from ductile chisel point fracture to shear fracture. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on the elongation is negligible at 175 °C. The low cycle fatigue test result shows that the fatigue life does not degrade even at 175 °C in all alloys investigated. The fatigue life of Sn-6.4Sb-3.9Ag-0.4Ni (mass%) is superior to those of Sn-6.4Sb-3.9Ag and Sn-6.4Sb-3.9Ag-0.03Ni (mass%) in the high cycle fatigue area. The electron back scattering diffraction (EBSD) analysis result shows that fine recrystallized grains are generated at the cracked area in Sn-6.4Sb-3.9Ag-0.4Ni in the fatigue test at 175 °C, and the crack progresses in a complex manner at the grain boundaries.

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The reliability of lead-free solder joint subjected to special environment: a review

Cited by 48 publications

References 141 publications

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

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