Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Xu, Jiachen; Wu, Mingyang; Pu, Juan; Xue, Songbai

doi:10.1155/2020/4969647

Cited by 9 publications

(3 citation statements)

References 70 publications

(88 reference statements)

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“…With the oxygen content increased from 18 to 77 ppm, the shear strength decreased by 44%, from the top value of 56.6 to 31.7 MPa, which is consistent with the deterioration trend in the microstructure of the solder joints. Besides, the shear strength was close to the results reported by some early literatures, although the test conditions were not so identical [18,19]. The pores and microcracks greatly decrease the bonding strength between the solder, interfacial IMC and the substrate and further decrease the shear strength, which can also be proved by the fracture morphologies shown in Figure 5.…”

Section: Effects Of Oxygen Content On Interfacial Microstructure and Strength Of Solder Jointssupporting

confidence: 86%

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

Li¹,

Wu²,

Zhang³

et al. 2021

Crystals

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The Au-20Sn solder is widely used in the packaging of high-end electronic products, and the requirement on the reliability of the solder joints is more and more strict with a continuous increase in the performance of the package products. As the oxygen content in the Au-Sn solder is a key factor dominating the quality of fluxless packaging, in this study, the wettability and spreading performance of the Au-20Sn solder with different oxygen contents and the interfacial microstructure, mechanical properties, gas tightness and ratio of soldering area of the Au-Sn/Cu solder joints prepared using these solders were comprehensively investigated to clarify the effects of trace oxygen content. The results reveal that the wetting and spreading performances of the solder decrease sharply with increasing oxygen conte[nt. When the oxygen content increased from 18 to 77 ppm, the spreading area of the solder on the Cu substrate decreased from 92.8 to 49.2 mm2, reducing by 47%. Meanwhile, pores and microcracks appear in the solder joint with relatively high oxygen content, making the shear strength decrease from 56.6 to 31.7 MPa. The oxygen also greatly affects the gas tightness and ratio of soldering area. For the optical window packaged using Au-Sn solder containing 40 ppm of oxygen, the leakage rate was higher than 5 × 10−11 mbar·m−3·s−1 and cannot fulfill the requirements. With increasing oxygen content in the Au-Sn solder, the cleanliness of the chip packaged with these solders deteriorated, and the solder surface was obviously oxidized. When the oxygen content was 18 ppm, the ratio of soldering area was 92%, but decreased sharply to 53% when the oxygen content increased to 77 ppm. It is demonstrated that an oxygen content lower than 27 ppm is required for the Au-20Sn solder used in fluxless packaging.

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Section: Effects Of Oxygen Content On Interfacial Microstructure and Strength Of Solder Jointssupporting

confidence: 86%

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

Li¹,

Wu²,

Zhang³

et al. 2021

Crystals

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“…High-Pb solders (e.g., 95Pb-5Sn (wt.%)) as high-temperature solders possess excellent soldering properties in electronic packaging and step soldering applications. Lead is harmful to both the environment and human health, and, thus, the use of high-Pb solders has been restricted [1][2][3]. The Au-Sn-based alloys have been proposed as alternative high-temperature Pb-free solders [4,5].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Description of the Au-Sb-Sn Ternary System

Tong

Rong

et al. 2023

Metals

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Phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system are important for the design of Au-based alloys as high-temperature lead-free solders to replace high-Pb solders. In this work, phase transition temperatures of five Sb-Sn alloys were measured using differential thermal analysis (DTA), and the temperatures of three invariant reactions were determined. Based on the measured experimental results in this work and the reported results, the Sb-Sn binary system was re-optimized using the CALPHAD method. The calculated results were in good agreement with available phase equilibria and thermodynamic data. This work was further combined with the previous assessments of the Au-Sn and Au-Sb binary systems and the present optimization of the Sb-Sn binary system to calculate the phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system, according to the reported experimental results, including thermodynamic properties and phase equilibria. The calculated liquidus projection, isothermal sections, vertical sections, as well as enthalpy of mixing and activity of Sn in liquid alloys are consistent well with the reported experimental results. A self-consistent set of thermodynamic parameters was obtained to accurately describe Gibbs energies of various phases in the Au-Sb-Sn ternary system, which would serve as a sound basis for developing a thermodynamic database of multicomponent Au-Sn-based alloy systems.

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“…The TriPleX carrier is based on alternating layers of SiN and Silicon Oxide (SiO 2 ) and a Si substrate [4], [26]. 5 µm-thick eutectic gold-tin (AuSn with 80/20 wt%) is used as solder with a reflow temperature of 278 • C. It is a state-of-the-art solder metal composition that is widely used for fluxless flip-chip assembly in optoelectronics packaging [27], [28], [29], [30]. Two laser soldering schemes were studied for photonic flip-chip bonding: through-silicon laser soldering and heat-conduction laser soldering.…”

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confidence: 99%

Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

Tian

Beste

Khachikyan

et al. 2023

IEEE J. Quantum Electron.

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Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Cited by 9 publications

References 70 publications

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

Thermodynamic Description of the Au-Sb-Sn Ternary System

Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

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