Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

Abstract

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Small and scalable laser source for AR glasses by hybrid integration of silicon nitride PIC technology

“…An artist impression of the total assembly is given in the left part of Figure 4. The basis of the process has been shown in the infrared wavelength domain 4,5 and is adapted to use in the visible wavelength domain. Also in this figure a microscope photo is given of three recesses, where two have been populated with a bare laser diode.…”

Packaging of micro-lens arrays to photonic integrated circuits using beam shape evaluation

“…As flip-chip bonding is becoming more prevalent as an electronic and photonic packaging solution (an alternative to wire-bonding) [31,32], the waveguides and couplers are mostly hidden from view during the packaging process. Design and assembly of such a package thus brings more challenges as vision is necessary for alignment and required for automated machine vision systems to identify features on the PIC.…”