Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

Yamamoto, M.; Shohji, Ikuo; Kobayashi, Tatsuya; Mitsui, Kohei; Watanabe, Hirohiko

doi:10.3390/ma14143799

Cited by 16 publications

(6 citation statements)

References 36 publications

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“…A lot of work has been put into developing new lead-free solders that support compact, lightweight, and more functional microelectronic devices that have low melting points, acceptable costs, and high stability [3]. The most well-known lead-free solders are Sn-Sb alloys because of their high reliability, excellent wettability, and high creep resistance [1,4]. Recently, Sn-5 wt% Sb solder has attention-grabbing due to its excellent characteristics when compared to other modernistic Pb-free solders.…”

Section: Introductionmentioning

confidence: 99%

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Mousa¹,

Mahmoud²,

El-Zhery³

et al. 2023

Phys. Scr.

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The role of minor additions of Ni and GOns to Sn- 5 wt.% Sb- 0.7 wt.% Cu (SSC-507) has been explored. Findings of scanning electron microscopy (SEM), energy dispersive X-ray spectrometry (EDX), and X-ray diffractometry (XRD) display the new phases like (Cu,Ni)6Sn5 and the size decrement of β-Sn grains. A slight increase in the melting temperature was observed using differential scanning calorimetry (DSC) analysis due to adding Ni (ΔTm =1.02 oC) and GOns (ΔTm =0.75 oC). Interestingly, 0.1 wt% Ni addition reduced the under-cooling by ~28 %, whenever adding of 0.1 wt% GOns enhanced the under-cooling by ~115 %. The average size of β-Sn grains of SSC-507 plain solder was decreased from ~150 to ~ 70 μm due to adding of Ni and then GOns. The enhanced creep resistance of SSC-Ni-GOns alloy motivated the values of creep fracture and enhanced the stress exponent parameters (n) by ~ 27%. The outcomes of tensile creep examination demonstrate that increasing levels of stress and testing temperatures raise the steady-state creep rates for all tested alloys. The average activation energy (E) for the three solders ranged from ~ 46.5 kJ/mol to ~ 54.3 kJ/mol which close to that of pipe-diffusion mechanism in Sn based solder alloy.

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Section: Introductionmentioning

confidence: 99%

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Mousa¹,

Mahmoud²,

El-Zhery³

et al. 2023

Phys. Scr.

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“…As a result, the selection of unleaded solders has become a crucial area of study inspiring researchers all over the world to find and create a novel class of lead-free alloys, including Sn-Sb, Sn-Zn, Sn-Bi, Sn-Ag, Sn-Zn-Bi, Sn-Ni-Mn, Sn-Ag-Cu and Sn-Sb-Cu [4][5][6][7][8][9][10][11][12]. Over the past few years, Sn-5 wt% Sb solder alloy has drawn attention because of its excellent properties if compared with other modernistic lead-free solders [13,14]. Sn-5 wt% Sb has a soldersubstrate contact angle of about 43°(good solderability) with higher mechanical properties, uniform microstructure, and 245 °C melting point [15,16].…”

Section: Introductionmentioning

confidence: 99%

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Mousa,

Sobhy,

Mahmoud

2024

Phys. Scr.

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The present research examined how cobalt microalloying additions of 0.25, 0.5, 0.75, and 1 weight percent affected the microstructural properties, thermal features, and tensile creep characteristics of eutectic Sn-5 wt.% Sb- 0.5 wt.% Cu (SSC) lead-free solder alloy. According to the results, cobalt additions of 0.25, 0.5, and 0.75 wt.% did not affect SbSn phase but significantly refined β-Sn grains, facilitating the formation of fine fibers (Cu,Co)6Sn5 together with plate-like CoSn3 phases, and preventing the formation of Cu6Sn5 phases. Furthermore, a large amount of cobalt (1wt.%) addition accumulated in the coarsening of the CoSn3 phase. Additions of 0.25 wt.% Co, 0.75 wt.% Co, and 1wt.% Co did not affect the melting temperatures, but pasty ranges had been slightly lowered, which may enhance the thermal characteristics. Addition of 0.5 wt.% Co had unfavorable effects on both melting point and pasty range. This has significant effects on solder reliability and electronic service performance. In terms of creep behavior, the SSC-0.75 wt.% Co specimens displayed the highest creep resistance because of the fine dispersion of intermetallic compounds (IMCs) and extended the creep-rupture life to a level that is 3.0 times greater than the SSC baseline. Lower creep resistance was observed in SSC-0.25 wt.% Co specimens, which was mostly due to the smaller volume fraction of the precipitate phases and the absence of the CoSn3 phase. Depending on the determined stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SSC-xCo solders is the dislocation climb controlled by short-circuit pipe diffusion across the whole temperature range that was examined.

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“…Lead-free solder is one of the current research hotspots [ 1 , 2 ], developed from the fusion of microelectronics technology and environmental protection requirements. Sn–Ag based solder cannot meet the development requirements of packaging technology due to its high melting point and high cost [ [3] , [4] , [5] , [6] ]. In order to improve the comprehensive properties of Sn–Ag based solders, many researchers have obtained lead-free solders with excellent performance by adding other elements.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Jin¹,

Tong²,

Liang³

et al. 2023

Heliyon

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Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

Cited by 16 publications

References 36 publications

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

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