The role of minor additions of Ni and GOns to Sn- 5 wt.% Sb- 0.7 wt.% Cu (SSC-507) has been explored. Findings of scanning electron microscopy (SEM), energy dispersive X-ray spectrometry (EDX), and X-ray diffractometry (XRD) display the new phases like (Cu,Ni)6Sn5 and the size decrement of β-Sn grains. A slight increase in the melting temperature was observed using differential scanning calorimetry (DSC) analysis due to adding Ni (ΔTm =1.02 oC) and GOns (ΔTm =0.75 oC). Interestingly, 0.1 wt% Ni addition reduced the under-cooling by ~28 %, whenever adding of 0.1 wt% GOns enhanced the under-cooling by ~115 %. The average size of β-Sn grains of SSC-507 plain solder was decreased from ~150 to ~ 70 μm due to adding of Ni and then GOns. The enhanced creep resistance of SSC-Ni-GOns alloy motivated the values of creep fracture and enhanced the stress exponent parameters (n) by ~ 27%. The outcomes of tensile creep examination demonstrate that increasing levels of stress and testing temperatures raise the steady-state creep rates for all tested alloys. The average activation energy (E) for the three solders ranged from ~ 46.5 kJ/mol to ~ 54.3 kJ/mol which close to that of pipe-diffusion mechanism in Sn based solder alloy.