Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Abstract

With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

“…TLPS thus is accompanied with a long bonding time [18][19][20]. Many approaches have been employed to accelerate the sintering time such as high-temperature/pressure bonding [19,21,22], incorporation of reactive additives [23][24][25][26], surface modification [27,28], and electric/laser-assisted bonding [29][30][31][32][33][34]. For instance, Ramli et al employed TiO 2 particles to reduce the thickness of the interfacial IMCs for the enhancement of the shear strength and hardness of the solder joints [24].…”

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

“…As the size and pitch of solder joints become smaller and smaller, residual flux removal is difficult, which adversely affects the device performance in use. Moreover, high temperature conditions will accelerate the diffusion of atoms at the solder interface, forming Kirkendall holes and threatening device reliability [ [28] , [29] , [30] ]. Cu–Sn low-temperature solid-state soldering has been considered as a potential solution to the above problems, where the soldering temperature ranges from 150 °C to 220 °C [ 31 , 32 ].…”

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

“…[2][3][4][5]. However, they face some challenges compared to Sn-Pb solders, such as poor wetting, a higher soldering temperature, and unsatisfactory mechanical properties [6]. Alloying or particle-strengthening methods can address these shortcomings [7].…”