The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects

Mehdizadeh, S.; Dukovic, John; Andricacos, P. C.; Romankiw, L. T.; Cheh, H. Y.

doi:10.1149/1.2221118

Cited by 61 publications

(34 citation statements)

References 4 publications

(4 reference statements)

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“…In order to improve and control the vertical anisotropy in the magnet arrays effectively as well as to reduce surface irregularity of electroplated materials, both ceramic magnets (Ferrimag 8A, Adams Magnetic Products, 3900 G) and a paddle agitator [10] were used to build the electroplating system as shown in Fig. 4.…”

Section: A Electroplating Of Permanent Magnetsmentioning

confidence: 99%

A bidirectional magnetic microactuator using electroplated permanent magnet arrays

Cho

Ahn

2002

J. Microelectromech. Syst.

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A novel bidirectional magnetic microactuator using electroplated permanent magnet arrays has been designed, fabricated and characterized in this work. To realize a bidirectional microactuator, CoNiMnP-based permanent magnet arrays have been fabricated first on a silicon cantilever beam using a new electroplating technique. In the fabricated permanent magnets, the vertical coercivity and retentivity have been achieved up to 87.6 kA/m (1100 Oe) and 190 mT (1900 G), respectively by applying magnetic field during electroplating. A prototype bidirectional magnetic microactuator has been realized by integrating an electromagnet with a silicon cantilever beam, which has permanent magnet arrays on its tip. By applying a dc current of 100 mA and altering its polarity, bidirectional motion on the tip of the cantilever beam has been successfully achieved in the deflection range of 80 m.[656]Index Terms-Bidirectional actuator, electroplated magnet, magnetic microactuator, permanent magnet array.

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Section: A Electroplating Of Permanent Magnetsmentioning

confidence: 99%

A bidirectional magnetic microactuator using electroplated permanent magnet arrays

Cho

Ahn

2002

J. Microelectromech. Syst.

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“…The auxiliary electrode is used here to tamper the edge and corner effect, 19 so that practically any remaining non-uniformity could be attributed to non-uniform active area density. Similar method was employed by Mehdizadeh et al 7 The AADR and AAD of the upper and lower half of the pattern is the same, but the width of the lines in the lower half region is double that of the upper region so that the effect of line width can also be studied.…”

Section: Methodsmentioning

confidence: 99%

Experimental Study of Acid Copper Electroplating of Non-Uniformly Patterned Substrate

Poon

Chin

Williams

2000

Journal of Electronics Manufacturing

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Factorial experiments were carried out to study the effects of the average cathodaic current density, electrode separation, and the active area density on the workpiece-level plating thickness variability for an acid copper pattern electroplating process. All the three parameters and the current density × electrode separation interaction were found to be significant, and an eight-term first-order prediction model was constructed and verified experimentally. The minimum variability achievable was found to increase with the active area density contrast over the board surface, and was explained by the scattering effect of the density contrast on the average plating thickness. Furthermore, these experiments showed that the pattern-level variation was different even though the two patterns have identical local average active area density and density contrast if their individual feature sizes are different. This suggested an interaction effect between the overall active area density and the density contrast of the substrate, and the possibility of further reducing the workpiece level variability by careful manipulation of such interaction.

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“…Wafer-to-wafer repeatability is very important in order to ensure uniform product characteristics, and within-die or within-feature thickness or alloy composition uniformity may also be critical factors. Some of these considerations mean that the microscale pattern density of the substrate may be important in terms of determining the results on the wafer or substrate [37][38][39].…”

Section: Wafer Plating Equipmentmentioning

confidence: 99%

Manufacturing Tools

Ritzdorf

2010

Modern Electroplating

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Commercial electroplating began almost two centuries ago. The manufacturing technology for a long time consisted of what we consider the minimum elements needed to deposit metal: open tanks, simple solutions for cleaning, rinsing, and electrodeposition, soluble or insoluble anodes, and a power source. There was virtually no ventilation or proper waste disposal. The entire operation was manual. Electroplating quality depended greatly on the experience and skill of the operator. Certain physical properties of deposits were improved after plating by heat treating or buffing [1]. Over the years the industry grew as an art. Improved processes and techniques were discovered along the way and many were kept secret until others heard about them or stumbled on the technology themselves. Eventually platers began filing patents to protect their rights to discoveries. About the same time entrepreneurs emerged to make a business of developing and selling new ideas for better plating solutions, techniques, and machinery. Following Edison's success with his research laboratory, many industrial companies established their own research and development laboratories, which included electroplating sections supporting manufacturing operations. Electroplating manufacturing technology was developed as needed:(1) to solve production problems, (2) to reduce cost, (3) to increase production rates, (4) to improve quality of the product, and (5) to meet new standards set by product designers and waste disposal regulations. Modern electroplating technologies developed for manufacturing include solutions with the best chemistry available, machines that automatically transport the product through all stages of processing, computerized monitoring, and control systems that also store and process data, online and offline inspection facility, rapid chemical analysis systems, and an efficient waste treatment system. Many developments have resulted from attempts to reduce manufacturing costs, such as increasing production rates with the same equipment, utilizing cheaper materials, or eliminating unnecessary process steps or equipment. Also new technologies originally developed in non-electroplating industries have been adopted for use in advanced electroplating. Software for machine automation, data logging, and data processing are good examples. Equipment designed specifically for electroplating semiconductor wafers and related microelectronic components have brought together all of the advanced control concepts and have led to great improvements in understanding the nature of the electroplating chemistries and processes that have been utilized in these applications.Fully automatic electroplating equipment can be justified only when large volumes of the same or similar product are processed. Modern automatic tools can be operated with fewer operators, but these people often must be more skilled and knowledgeable about instrumentation, sensors, and computers as well as electroplating. ELECTROPLATING EQUIPMENTAutomated plating machines were invented ...

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The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects

Cited by 61 publications

References 4 publications

A bidirectional magnetic microactuator using electroplated permanent magnet arrays

A bidirectional magnetic microactuator using electroplated permanent magnet arrays

Experimental Study of Acid Copper Electroplating of Non-Uniformly Patterned Substrate

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