Manufacturing Tools

Abstract

Commercial electroplating began almost two centuries ago. The manufacturing technology for a long time consisted of what we consider the minimum elements needed to deposit metal: open tanks, simple solutions for cleaning, rinsing, and electrodeposition, soluble or insoluble anodes, and a power source. There was virtually no ventilation or proper waste disposal. The entire operation was manual. Electroplating quality depended greatly on the experience and skill of the operator. Certain physical properties of deposits were improved after plating by heat treating or buffing [1]. Over the years the industry grew as an art. Improved processes and techniques were discovered along the way and many were kept secret until others heard about them or stumbled on the technology themselves. Eventually platers began filing patents to protect their rights to discoveries. About the same time entrepreneurs emerged to make a business of developing and selling new ideas for better plating solutions, techniques, and machinery. Following Edison's success with his research laboratory, many industrial companies established their own research and development laboratories, which included electroplating sections supporting manufacturing operations. Electroplating manufacturing technology was developed as needed:(1) to solve production problems, (2) to reduce cost, (3) to increase production rates, (4) to improve quality of the product, and (5) to meet new standards set by product designers and waste disposal regulations. Modern electroplating technologies developed for manufacturing include solutions with the best chemistry available, machines that automatically transport the product through all stages of processing, computerized monitoring, and control systems that also store and process data, online and offline inspection facility, rapid chemical analysis systems, and an efficient waste treatment system. Many developments have resulted from attempts to reduce manufacturing costs, such as increasing production rates with the same equipment, utilizing cheaper materials, or eliminating unnecessary process steps or equipment. Also new technologies originally developed in non-electroplating industries have been adopted for use in advanced electroplating. Software for machine automation, data logging, and data processing are good examples. Equipment designed specifically for electroplating semiconductor wafers and related microelectronic components have brought together all of the advanced control concepts and have led to great improvements in understanding the nature of the electroplating chemistries and processes that have been utilized in these applications.Fully automatic electroplating equipment can be justified only when large volumes of the same or similar product are processed. Modern automatic tools can be operated with fewer operators, but these people often must be more skilled and knowledgeable about instrumentation, sensors, and computers as well as electroplating. ELECTROPLATING EQUIPMENTAutomated plating machines were invented ...

Deposition Technologies

“…Paddle cells based on the original design have been used for fabricating thin-film heads for peripheral storage devices [155]. By now, paddle cells are also used widely in microelectronics and MEMS fabrication.…”