The Impact of Organic Additives on Copper Trench Microstructure

Marro, James; Okoro, Chukwudi; Obeng, Yaw S.; Richardson, Kathleen

doi:10.1149/2.1131707jes

Cited by 15 publications

(8 citation statements)

References 37 publications

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“…As expected, the use of the Ni foam porous substrate facilitated higher roughness values, which may further exhibit a positive influence on the electroanalytical characteristics of the electrode, in agreement also with data reported in [45]. In addition, an increase of the roughness factor was noticed in the case of the Cu/Nif electrode, which may be attributed to the Cu electrodeposition procedure which involved an additive-free electrolyte, thus leading to a slightly more porous surface, in agreement with [51].…”

Section: Electrochemical Characterization Of 3d Cu Nanoporous Electrodessupporting

confidence: 88%

Electrochemical Non-Enzymatic Detection of Glucose Based on 3D Electroformed Copper on Ni Foam Nanostructures

et al. 2020

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Despite the fact that the electrochemical biosensors based on glucose oxidase represent the golden standard for the management of diabetes, the elaboration of nonenzymatic sensors became extensively studied as an out-of-the-box concept that aims to simplify the existing approach. An important point of view is represented by the low price of the sensing device that has positive effects for both end-users and healthcare systems. The enzyme-free sensors based on low-cost materials such as transition metals have similar analytical properties to the commercial ones while eliminating the issues associated with the presence of the enzyme, such as the stability issues and limited shelf-life. The development of nanoporous nanomaterials for biomedical applications and electrocatalysis was referred to as an alternative to the conventional methods due to their enlarged area, electrical properties, ease of functionalization and not least to their low cost. Herein, we report the development of an electrochemical nonenzymatic sensor for glucose based on 3D copper nanostructures with Ni foams as promotor of the enhanced nanoporous morphology. The sensors were successfully tested in the presence of the designated target, even in the presence of common interference agents found in biological samples.

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Section: Electrochemical Characterization Of 3d Cu Nanoporous Electrodessupporting

confidence: 88%

Electrochemical Non-Enzymatic Detection of Glucose Based on 3D Electroformed Copper on Ni Foam Nanostructures

et al. 2020

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“…[56,61,62,68,105]. The interconnects industry has already evolved methods, such as using organic additives, altering electrodeposition parameter, and post-fabrication processing for Cu grain control, which can be borrowed and tested for Cu/CNT preparation [122][123][124][125].…”

Section: Control Cnt and Cu-matrix Attributesmentioning

confidence: 99%

“…(a) Cu/CNT for mainstream electronics: For the electronics industry, electrodeposition-based Cu/ CNT fabrication methods are most compatible. Co-electrodeposition is closest to the current processing technologies used by the electronics industry (damascene process [122][123][124][125]). However, coelectrodeposition entails several Cu/CNT structure control issues that need solving, such as obtaining individually dispersed long CNTs for homogeneous composite fabrication, controlling nanotube alignment, etc.…”

Section: Cu/cnt For Mainstream Applicationsmentioning

confidence: 99%

Copper/carbon nanotube composites: research trends and outlook

et al. 2018

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We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.

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“…Because additives change the crystal structures of Cu films in general, 45 the change in crystal structures by JGB can affect the surface morphology and deposition rate of Cu. Figure 4 shows the characteristics of the Cu film on the planar substrate with the increasing concentration of JGB at −0.025 V. Figure 4a Figure 5 illustrates the initial stage of chronoamperometry at −0.025 V, which is critical for understanding the nucleation behavior of Cu with the concentration of JGB and agitation conditions.…”

Section: Resultsmentioning

confidence: 99%

Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B

Lee,

Kim,

Han

et al. 2023

ECS J. Solid State Sci. Technol.

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A fine-pitch redistribution layer (RDL) for high-performance devices in a fan-out wafer-level package (FOWLP) is required in semiconductor packaging technology. The damascene process for fine-pitch RDL has been studied for several years, which has been introduced to overcome the etching problems. Although surface planarization for removing overburden is necessary for the damascene process in RDL, it adds high cost to the FOWLP process. Selective Cu electrodeposition is a method used to prevent overburden. Janus Green B (JGB) is utilized as a leveler in Cu electrodeposition and has properties that depend on concentration and agitation. These properties affected the Cu deposition rate according to the pattern position. Thus, the electrochemical properties of JGB were investigated based on the concentration of JGB and agitation. Furthermore, the effect of JGB on the crystalline structure of the Cu film was examined. Additionally, changes in the growth behavior of the Cu nuclei caused by JGB were observed during the initial stage of chronoamperometry. Based on these results, selective Cu electrodeposition was successfully performed on the patterned substrate using the difference in the concentration of JGB and agitation.

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The Impact of Organic Additives on Copper Trench Microstructure

Cited by 15 publications

References 37 publications

Electrochemical Non-Enzymatic Detection of Glucose Based on 3D Electroformed Copper on Ni Foam Nanostructures

Electrochemical Non-Enzymatic Detection of Glucose Based on 3D Electroformed Copper on Ni Foam Nanostructures

Copper/carbon nanotube composites: research trends and outlook

Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B

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