1999
DOI: 10.1016/s0925-9635(98)00371-9
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The effect of nitrogen on the growth, morphology, and crystalline quality of MPACVD diamond films

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Cited by 32 publications
(22 citation statements)
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“…The amount of nitrogen present in the reaction mixture has a large influence on the deposition process and the deposited diamond. Several authors have studied the effect of nitrogen addition during diamond CVD [1][2][3][4][5][6][7] and it has been found that the addition of small amounts of nitrogen leads, among other things, to an increase of the deposition rate 4,7 and a preferred ͕100͖ texture. 1,2,5,7,8 Despite the considerable number of studies on the effects of nitrogen addition during diamond CVD processes, it is not clear what nitrogen-containing species is or are reponsible for the observed changes.…”
Section: Introductionmentioning
confidence: 99%
“…The amount of nitrogen present in the reaction mixture has a large influence on the deposition process and the deposited diamond. Several authors have studied the effect of nitrogen addition during diamond CVD [1][2][3][4][5][6][7] and it has been found that the addition of small amounts of nitrogen leads, among other things, to an increase of the deposition rate 4,7 and a preferred ͕100͖ texture. 1,2,5,7,8 Despite the considerable number of studies on the effects of nitrogen addition during diamond CVD processes, it is not clear what nitrogen-containing species is or are reponsible for the observed changes.…”
Section: Introductionmentioning
confidence: 99%
“…The multifarious roles of nitrogen addition into CH 4 /H 2 plasma on tailoring the growth of CVD diamond films ranging from large-grained 100 textured to fine grained nanocrystalline have been demonstrated depending either on the amount of N 2 addition or on the other growth parameters (for example, pressure, power, temperature, and methane . [12][13][14][15][16][17][18] For instance, trace amounts of nitrogen addition can facilitate the formation of high-quality large-grained 100 textured diamond at low pressure (N 2 10-200 ppm, CH 4 /H 2 0.5-2%, substrate temperature T subs ∼ 800 C, pressure 50 Torr), 12 while much higher N 2 concentration about 4% has been employed to deposit NCD (a gas mixture of CH 4 /H 2 /N 2 with flow rates of 2∼15/190/8 sccm, respectively, the microwave power was varied between 550 W and 1000 W, the reactant pressure was altered in the range of 13-28 Torr, and the substrate temperature was maintained at 800 C. 18 In this work, we report that NCD films can be produced by employing a new growth parameter window, i.e., using medium amount of N 2 addition (say, 0.24%) under a conventional condition for the growth of a high quality large grained polycrystalline diamond film, say, high microwave power 3000 W, high pressure 105 Torr, 4% methane in H 2 , and substrate surface temperature ∼750 C. Furthermore, by overlapping a small silicon slice on a large silicon wafer of 5.08 cm in diameter to achieve two different substrate temperatures in one single deposition run, both a NCD film grown at low temperature and a 100 textured largegrained diamond film deposit at high temperature can be prepared simultaneously. These new results demonstrate that distinct growth modes were involved or coupled effect of nitrogen addition and temperature happened.…”
Section: Introductionmentioning
confidence: 99%
“…Because of these promising properties, a-CN:H has been considered for applications such as hard coating [1], solar cell passivation [2], biocompatible coating [3], and as a buffer layer organic photo-detector [4]. The a-CN:H films are prepared by various methods such as pulsed laser deposition [5], ion beam deposition [6], sputtering [7], plasma-enhanced chemical vapor deposition (PECVD) [8], electron cyclotron resonance chemical vapor deposition (ECRCVD) [9], microwave plasma-assisted chemical vapor deposition (MPACVD) [10] and hot-wire chemical vapor deposition (HWCVD) [11]. HWCVD is a promising deposition technique that permits both carbon and silicon based alloy films having superior structural and electronic properties to those prepared by conventional PECVD at high deposition rate and low substrate temperatures [12,13].…”
Section: Introductionmentioning
confidence: 99%