2022
DOI: 10.1109/ted.2022.3200301
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The Device Instability of p-GaN Gate HEMTs Induced by Self-Heating Effect Investigated by on-State Drain Current Injection (DCI) Technique

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Cited by 4 publications
(1 citation statement)
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“…Finally, the variations in gate current, drain leakage, and gate capacitance were provided in order to verify the mechanism. Chen J. et al [ 17 ] investigated the device stability of p-GaN gate HEMTs under self-heating effects using the on-drain current injection technique. By analyzing the gate leakage current as well as simulating the TCAD of the electrically heated device, it was shown that the self-heating-induced V TH instability is electron trapping in the p-GaN gate stack.…”
Section: Introductionmentioning
confidence: 99%
“…Finally, the variations in gate current, drain leakage, and gate capacitance were provided in order to verify the mechanism. Chen J. et al [ 17 ] investigated the device stability of p-GaN gate HEMTs under self-heating effects using the on-drain current injection technique. By analyzing the gate leakage current as well as simulating the TCAD of the electrically heated device, it was shown that the self-heating-induced V TH instability is electron trapping in the p-GaN gate stack.…”
Section: Introductionmentioning
confidence: 99%