2020
DOI: 10.1007/s10825-020-01578-3
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The analog/RF performance of a strained-Si graded-channel dual-material double-gate MOSFET with interface charges

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Cited by 13 publications
(5 citation statements)
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“…The performance analysis of proposed TMGS-GCDG-JL s-Si MOSFET is compared with existing works in the previous works, as demonstrated in Table 2. The voltage gain, f t , and GTFP of proposed TMGS-GCDG-JL s-Si MOSFET (m=0.2 and t ox2 = 1nm) are better than when compared to the GS-GCDG-JL s-Si MOS-FET (m=0.2 and t ox2 = 1nm), high-k spacer DG junctionless MOSFET [14], DG junctionless MOSFET with channel length 20 nm [19], GC DG junctionless device with channel length 30 nm [20] and strained-Si GC-DMDG MOSFET with channel length 20 nm [29]. However, the proposed TMGS-GCDG-JL s-Si MOSFET has lower early voltage than high-k spacer DG junctionless MOSFET [14].…”
Section: Results Analysismentioning
confidence: 95%
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“…The performance analysis of proposed TMGS-GCDG-JL s-Si MOSFET is compared with existing works in the previous works, as demonstrated in Table 2. The voltage gain, f t , and GTFP of proposed TMGS-GCDG-JL s-Si MOSFET (m=0.2 and t ox2 = 1nm) are better than when compared to the GS-GCDG-JL s-Si MOS-FET (m=0.2 and t ox2 = 1nm), high-k spacer DG junctionless MOSFET [14], DG junctionless MOSFET with channel length 20 nm [19], GC DG junctionless device with channel length 30 nm [20] and strained-Si GC-DMDG MOSFET with channel length 20 nm [29]. However, the proposed TMGS-GCDG-JL s-Si MOSFET has lower early voltage than high-k spacer DG junctionless MOSFET [14].…”
Section: Results Analysismentioning
confidence: 95%
“…However, the proposed TMGS-GCDG-JL s-Si MOSFET has lower early voltage than high-k spacer DG junctionless MOSFET [14]. Moreover, the proposed TMGS-GCDG-JL s-Si MOSFET has lower g m than strained-Si GC-DMDG MOSFET with channel length 20 nm [29]. Therefore, the proposed MOSFET using the TMG with GC engineering and gate stack techniques achieves improved overall analog/RF performance.…”
Section: Results Analysismentioning
confidence: 99%
“…Transconductance Frequency Product (TFP) and, Gain Transconductance Frequency Product (GTFP) also important RF parameters . 28,29 Maximizing TFP helps in optimizing the performance of amplifiers, oscillators, filters, and other circuits in various electronic systems. Additionally, GTFP provide valuable insights into the performance of MOSFET circuits, particularly in amplifier design, frequency response analysis, high-frequency applications, low-noise amplifiers, oscillator circuits, and active filters.…”
Section: Simulation Of Device and Discussionmentioning
confidence: 99%
“…Figures 1 and 2, respectively, display the simulation flow and cross-section layout for n-JLSDGM device. The main substrate of this device was based on SiGe material (Ge<20%) with a thickness of 8nm, mainly opted due to its larger lattice constant than Si [30]. The ultrathin Si layer (1 nm) was then deposited on the top of the main SiGe layer, thus forming a strained Si layer.…”
Section: Device Dimension and Simulationmentioning
confidence: 99%