2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS) 2015
DOI: 10.1109/mwscas.2015.7282148
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Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

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Cited by 23 publications
(11 citation statements)
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“…New three-dimensional (3D) IC technology will change the current IC supply chain model and may produce new vulnerabilities. For instance, Hasan et al proposed a novel HT that utilized the unique structure of 3D ICs [116]. Such a Trojan circuit can only be triggered by the thermal effect of middle tiers in 3D ICs.…”
Section: ) Newly Emerging Threatsmentioning
confidence: 99%
“…New three-dimensional (3D) IC technology will change the current IC supply chain model and may produce new vulnerabilities. For instance, Hasan et al proposed a novel HT that utilized the unique structure of 3D ICs [116]. Such a Trojan circuit can only be triggered by the thermal effect of middle tiers in 3D ICs.…”
Section: ) Newly Emerging Threatsmentioning
confidence: 99%
“…However, to avoid failures, the clock period can be managed to counter the system glitches. The authors in [43] have, nevertheless, suggested that despite clock management, the period of momentary glitches tends to increase with NBTI and may set off pre-determined activity related to malicious circuitry.…”
Section: A Design Considerationsmentioning
confidence: 99%
“…As indicated, this is especially attractive for 3D chips where such monitors can be implemented in trustworthy dies, separated from the potentially Trojaninfected legacy chips [127], [129], [130], [139]. Nevertheless, some Trojans may be crafted specifically for 3D integration and end up being "buried somewhere in the midst of the 3D chip"; they are harder to detect during runtime [134], and may also exploit distinct trigger mechanisms such as increased internal heating [154].…”
Section: Detection Of Hardware Trojansmentioning
confidence: 99%