Technology Roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Abstract

This paper presents a review and summary of the PSMA "PSiP2PwrSoC" special project that investigated the technology and performance underpinning recent commercial developments in Power Supply in Package and Power Supply on Chip. The results of this study are based on the identification of more than 28 commercial products, six of which were analyzed in detail, both physically and electrically. The methodology of the project is described and some of the salient results of this benchmarking effort are presented. In this study, a representative subset of the available commercial products was selected and a comprehensive physical, electrical and thermal performance analysis was carried out. The objectives were to identify the components, materials and assembly technologies used, and to determine if the drive toward greater integration and higher power density affected the performance of newer devices. The results of the analysis were then used to determine the current state of the technology in this application space, to show how it has developed to date and to predict how it might progress in the future. These results are presented in a generic format that does not identify individual products. This project was co-sponsored by the PSMA and member companies. The final report of the project, which includes more detailed information on the reviews described here as well as considerable trending analysis, is now available.Index Terms-Power supply in package (PSiP), power supply on chip (PwrSoC).

Microfabricated Air-Core Toroidal Inductor in Very High-Frequency Power Converters

“…While most electronic systems have been advanced rapidly with a dramatic decrease in size and cost, power supply technology is lagging behind. Power supplies are still bulky, inefficient, and costly [4]- [6]. Power supply in package (PwrSiP) [5], [6] and power supply on chip (PwrSoC) [5]- [10] are the vision of power supplies with high efficiency, high power density, and low cost.…”

“…Power supplies are still bulky, inefficient, and costly [4]- [6]. Power supply in package (PwrSiP) [5], [6] and power supply on chip (PwrSoC) [5]- [10] are the vision of power supplies with high efficiency, high power density, and low cost. Taking advantages of microelectromechanical systems (MEMS) fabrication technologies, miniaturized silicon-based inductors can be fabricated with high quality factor, high operating frequency, and high inductance thus enabling their usage in power supplies as energy storage elements.…”

UHF power conversion with GaN HEMT class-E2 topologies

“…This has been mainly motivated by the interest in miniaturization [1], but also by the irruption of modern systems with demanding specifications. That is the case, for instance, of the non-contact connection required between the input and output circuits of the converter in a wireless power transmission link [2], or of the very fast dynamic response to be expected from the one to be employed as envelope modulator in a wireless signal transmitter [3].…”

Energy-Efficient Power Delivery System Paradigms for Many-Core Processors

“…As the power delivery system is moving towards to on-chip solutions, the industry has begun to explore how to implement integrated modules as on-chip paradigms from in-Package(iP) to 2.5D to 3D [12] [13] in a trend of being closer to the target chip, which also diversifies the implementation of power delivery systems. The following are the related definitions for the power delivery system paradigms investigated in this paper.…”