Thermal desorption spectrometry measurements were performed for Ar implanted Si samples. Implantation energy Ei varied in the range 85175 keV. The release of implanted Ar in two steps was observed in the temperature range 9301300 K: the relatively narrow peak at lower temperature (≈ 930 K for implantation uence 5 × 10 16 cm −2 ) is due to the release of Ar from the agglomerations (bubbles) while the broader peak observed for higher temperatures (≈ 950 K for implantation uence 5 × 10 16 cm −2 ) comes from Ar atoms diusing out of the sample. Inverse order of peaks is observed compared to the results for lower energy implantations (< 50 keV). Analyzing the thermal desorption spectra collected for dierent heating ramp rates enabled estimation of the desorption activation energy (2 eV for Ei = 85 keV and 1.7 eV for Ei = 115 keV).