“…The smart-cut process depends on different parameters, such as temperature and annealing time [ 8 ], He and H fluences [ 14 ], the He to H fluences ratio [ 15 ], He and H relative depth distributions (imposed by respective ion energies [ 16 ]) and the relative order of He and H implantation [ 17 ]. In the early period, most interest in the applications of this method was devoted to studying helium bubble formation and evolution in semiconductors [ 18 , 19 , 20 , 21 , 22 , 23 ]. During He implantation, numerous helium atoms and cascade collision-induced Frenkel pairs are introduced.…”