Synthesis of CuInSe2 thin films from electrodeposited Cu11In9 precursors by two-step annealing

Chang, Tsung Wei; Hu, Shao Yu; Lee, Wen Hsi

doi:10.5599/jese.2014.0042

Cited by 2 publications

(1 citation statement)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…They used a thermal process treating Cu-In precursors to form uniform Cu 11 In 9 binary compounds. After the Se layer was electrodeposited on the Cu 11 In 9 layer, an annealing process was employed to form a chalcopyrite CIS compound [12]. Sidali et al co-electrodeposited the mixed Cu-In-Ga oxides and thermally reduced them into metallic alloys and selenization, then the CIGS films were synthesized [13].…”

Section: Introductionmentioning

confidence: 99%

Fabrications of Hetero-Junction Schottky Diodes by Electrodeposition of Nano-Structured CuInSe2 Materials Using Different Upper Electrodes

Liu

Houng

et al. 2020

Coatings

View full text Add to dashboard Cite

In this study, CuInSe2 (CIS) films (CIS-TFs) and nanorods (CIS-NRs) were successfully deposited on Mo/glass and p+-silicon (p+-Si) using an electrodeposition method. Anodic aluminum oxide (AAO) was used as the template when the CIS-NRs were deposited. Pt, indium tin oxide (ITO), and Ag were deposited as the upper electrodes using a sputtering method to form the hetero-junction devices of Pt/CIS-NRs/p+-Si, ITO/CIS-NRs/p+-Si, ITO/CIS-TF/Mo/glass, and Ag/CIS-NRs/p+-Si, respectively. When p+-Si was used as the substrate, Al was deposited on p+-Si to form negative electrodes for the devices of Pt/CIS-NRs/p+-Si, ITO/CIS-NRs/p+-Si, and Ag/CIS-NRs/p+-Si. The current–voltage properties of all the hetero-junction devices were measured and we found that the hetero-junction of ITO/CIS-NRs/p+-Si, ITO/CIS-TF/Mo/glass, and Ag/CIS-NRs/p+-Si devices revealed the properties of Schottky diodes but the hetero-junction device of Pt/CIS-NRs/p+-Si device did not. The reason for the cause of the differences between these hetero-junction devices was investigated for this study.

show abstract

Section: Introductionmentioning

confidence: 99%