“…Nevertheless, the quest for new interlayer materials still continues for purposes such as surface passivation, barrier height modification, leakage current minimization, and so on. Therefore, recently, some researchers focus on improvement of the performance or quality of these devices especially by using polymeric interlayer materials due to their high surface area to volume rate, low cost, low weight, good mechanical strength, charge storage capacity, flexibility, high dielectric strength, and their suitability to easy preparation methods such as electrospinning, solid–liquid phase separation, and template synthesis . Owing to these unique properties of polymeric materials, metal–polymer–semiconductor (MPS) structures have become an attractive research topic for physicists, chemists, and electrical and electronics engineers as well.…”