Suspended membranes, cantilevers and beams using SU-8 foils

Melai, J.; Carballo, V.M. Blanco; Salm, Cora; Schmitz, Jurriaan

doi:10.1016/j.mee.2009.10.035

Cited by 6 publications

(8 citation statements)

References 23 publications

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“…(4) 50-nm-thick TiW and 350-nm-thick Cu layers are successively deposited over the bridge layer by magnetron sputtering at room temperature. (5) The metal layers are then patterned by photolithography and dry etched by ion beam etching to form cantilevers and double-clamped beams. (6) The photoresist bridge layer is removed by O2 plasma to release the beams.…”

Section: Statnding Beamsmentioning

confidence: 99%

“…Laminated dry film resist demonstrates a unique ability to cross over pre etched through holes or trenches by paste coating [3][4][5], which emerges as a new alternative for the fabrication of free-standing structures over pre etched through holes and deep trenches. However, the thickness of the dry films is usually over 15 !lm, which decreases the planarity of the wafer surfaces when the films are used as bridge layers.…”

Section: Introductionmentioning

confidence: 99%

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Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Yang

Dou

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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This paper outlines a novel technique for using suspended photoresist above holes and trenches as planar bridge layer in the fabrication of through silicon vias ( T SVs) and beams. Photoresist film is formed through self-assembly on water surface and then transferred to a wafer as planar bridge layer to cover previously fabricated holes and trenches, which can be patterned with photolithography. The suspension capability of the photoresist bridge layer increases with the film thickness. 300 to 500 nm thick photoresist films are able to be suspended on through-vias of up to 60 �m in diameter and 50 �m wide trenches. A novel process flow of TSV has been developed. TSVs of up to 60 �m in diameter have been fabricated, and the upper side of the TSVs is automatically planarized. Cu beams suspended above deep trenches have also been fabricated with the technique. KEYWORDS

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Section: Statnding Beamsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Yang

Dou

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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“…Different fabrication processes have been proposed to fabricate 3D SU-8 microstructures with UV photolithography e.g. using a polymerization stop layer SU-8 foil or highly optimized UV exposures at different wavelengths [28]- [30]. The complexity of the fabrication process increases as the structures become multilayered (i.e.…”

Section: Introductionmentioning

confidence: 99%

Suspended 3D pyrolytic carbon microelectrodes for electrochemistry

Hemanth¹,

Caviglia²,

Keller³

2017

Carbon

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“…The most common process involves adding a polymerization-stop-layer between the structures to be suspended and the substrate [13], [14]. Alternatively lamination of a polymer foil on top of a patterned template followed by patterning of the foil has been proposed [15], [16]. The complexity of these fabrication processes increases as the structures become multi-layered (i.e.…”

Section: Introductionmentioning

confidence: 99%

Suspended microstructures of epoxy based photoresists fabricated with UV photolithography

Hemanth¹,

Anhj

Caviglia³

et al. 2017

Microelectronic Engineering

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In this work we present an easy, fast, reliable and low cost microfabrication technique for fabricating suspended microstructures of epoxy based photoresists with UV photolithography. Two different fabrication processes with epoxy based resins (SU-8 and mr-DWL) using UV exposures at wavelengths of 313 nm and 405 nm were optimized and compared in terms of structural stability, control of suspended layer thickness and resolution limits. A novel fabrication process combining the two photoresists SU-8 and mr-DWL with two UV exposures at 365 nm and 405 nm respectively provided a wider processing window for definition of well-defined suspended microstructures with lateral dimensions down to 5 µm when compared to 313 nm or 365 nm UV photolithography processes.

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Suspended membranes, cantilevers and beams using SU-8 foils

Cited by 6 publications

References 23 publications

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Suspended 3D pyrolytic carbon microelectrodes for electrochemistry

Suspended microstructures of epoxy based photoresists fabricated with UV photolithography

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