2013
DOI: 10.1063/1.4827821
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Surface passivation of n-type c-Si wafers by a-Si/SiO2/SiNx stack with <1 cm/s effective surface recombination velocity

Abstract: The passivation quality of an a-Si/SiO2/SiNx (aSON) stack deposited by conventional PECVD at <250 °C with and without additional corona charging of SiNx is presented. <2 fA/cm2 surface dark saturation current density and <1 cm/s effective surface recombination velocity were demonstrated on both planar and textured n-type Czochralski (CZ) substrates. It was shown that very good passivation can be achieved using <5 nm a-Si layers to provide low parasitic absorption. We also report eff… Show more

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Cited by 23 publications
(16 citation statements)
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“…It is clear that the results in this work are the among lowest recombination observed for a 1 Ω cm ⟨100⟩ Si surface. Similarly low surface recombination was reported by Herasimenka in 2013 yet their work was done on higher resistivity silicon. Additionally, the oxide and nitride layers here reported were deposited using an in‐line industrial system.…”
Section: Resultssupporting
confidence: 76%
“…It is clear that the results in this work are the among lowest recombination observed for a 1 Ω cm ⟨100⟩ Si surface. Similarly low surface recombination was reported by Herasimenka in 2013 yet their work was done on higher resistivity silicon. Additionally, the oxide and nitride layers here reported were deposited using an in‐line industrial system.…”
Section: Resultssupporting
confidence: 76%
“…The lowest observed recombination at the a‐Si/c‐Si interface has been that reported by Herasimenka et al and Bonilla et al . Herasimenka demonstrated SRVs of 0.086 cm s −1 in 1.7 Ωcm n‐type Si, while Bonilla achieved 0.06 cm s −1 in 1 Ωcm n‐type Si.…”
Section: Materials and Methods For Silicon Surface Passivationmentioning
confidence: 71%
“…15,[36][37] Intrinsic a-Si:H has been demonstrated to provide a high quality passivation of c-Si surfaces. [38][39][40][41][42] This is attributable to a very low defect density at the a-Si:H/c-Si interface, assisted in part by the high concentration (~10-20% atomic) of hydrogen incorporated into the films, which migrates to the interface and passivates remaining c-Si dangling bonds. [43][44][45] As shown in Figure 3(a), upon the insertion of a 6.5nm-thick a-Si:H layer between MgF 2 and n-Si, the surface passivation quality is markedly enhanced, yielding more than two orders of magnitude improvement in carrier lifetime, from 15 µs to 4088 µs.…”
Section: Resultsmentioning
confidence: 98%