2016
DOI: 10.1002/pssr.201600307
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Extremely low surface recombination in 1 Ω cm n‐type monocrystalline silicon

Abstract: A key requirement in the recent development of highly efficient silicon solar cells is the outstanding passivation of their surfaces. In this work, plasma enhanced chemical vapour deposition of a triple layer dielectric consisting of amorphous silicon, silicon oxide and silicon nitride, charged extrinsically using corona, has been used to demonstrate extremely low surface recombination. Assuming Richter's parametrisation for bulk lifetime, an effective surface recombination velocity Seff = 0.1 cm/s at Δn = 101… Show more

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Cited by 20 publications
(14 citation statements)
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References 33 publications
(30 reference statements)
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“…HF passivation also gives excellent passivation in n‐type silicon, however lower S have been reported using thin films (see Section 4.4). Compared to the best dielectric passivation films to date, HF passivation has demonstrated equivalent passivation levels, which is astonishing considering the basic principles of the technique.…”
Section: Types Of Temporary Surface Passivationmentioning
confidence: 98%
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“…HF passivation also gives excellent passivation in n‐type silicon, however lower S have been reported using thin films (see Section 4.4). Compared to the best dielectric passivation films to date, HF passivation has demonstrated equivalent passivation levels, which is astonishing considering the basic principles of the technique.…”
Section: Types Of Temporary Surface Passivationmentioning
confidence: 98%
“…Charge modification (e.g., by corona charging) can be used to improve the properties of as‐deposited dielectrics. Even better passivation can be achieved with stacks of materials …”
Section: Motivation For Temporary Passivationmentioning
confidence: 99%
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“…Specifically, hydrogen-rich silicon nitride (SiN x :H) [4], aluminum oxide (Al 2 O 3 ) [5], and amorphous silicon (a-Si:H) [6] have all demonstrated surface recombination velocities (S) of < 1 cm/s, with additional corona charging giving S as low as 0.1 cm/s in some cases [7]. It is, therefore, no surprise that a record efficiency of 26.6% [8] has been achieved by utilizing vacuum-deposited a-Si:H films for exceptional surface passivation, which in contrast to thermal oxidations, also retain very long carrier diffusion lengths during cell fabrication, owing to the low processing temperatures for this cell architecture (< 300°C).…”
mentioning
confidence: 99%
“…PECVD amorphous silicon (a‐Si) using silane and hydrogen as precursors . PECVD silicon oxide (SiO x ) using silane and nitrous oxide as precursors . And last, plasma‐assisted atomic layer deposited (PA‐ALD) aluminum oxide using a Oxford Instruments OpAL reactor .…”
Section: Methodsmentioning
confidence: 99%