Surface adhesion and demolding force dependence on resist composition in ultraviolet nanoimprint lithography

Amirsadeghi, Alborz; Lee, Jaejong; Park, Sunggook

doi:10.1016/j.apsusc.2011.09.090

Cited by 44 publications

(40 citation statements)

References 24 publications

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“…Compared to using the patterned Si directly as the embossing stamp, the UV resin stamp possesses a lower Young's modulus (600-800 MPa) 56 and a thermal expansion coefficient that is similar to that of PMMA (6 × 10 −5 /°C). This leads to a reduction in the adhesion and thermal stress during thermal embossing of the nanofluidic device 57,58 producing nanofluidic devices with high structural integrity.…”

Section: Resultsmentioning

confidence: 99%

Surface charge, electroosmotic flow and DNA extension in chemically modified thermoplastic nanoslits and nanochannels

Uba

Pullagurla

Sirasunthorn

et al. 2015

Analyst

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105

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Thermoplastics have become attractive alternatives to glass/quartz for microfluidics, but the realization of thermoplastic nanofluidic devices has been slow in spite of the rather simple fabrication techniques that can be used to produce these devices. This slow transition has in part been attributed to insufficient understanding of surface charge effects on the transport properties of single molecules through thermoplastic nanochannels. We report the surface modification of thermoplastic nanochannels and an assessment of the associated surface charge density, zeta potential and electroosmotic flow (EOF). Mixed-scale fluidic networks were fabricated in poly(methylmethacrylate), PMMA. Oxygen plasma was used to generate surface-confined carboxylic acids with devices assembled using low temperature fusion bonding. Amination of the carboxylated surfaces using ethylenediamine (EDA) was accomplished via EDC coupling. XPS and ATR-FTIR revealed the presence of carboxyl and amine groups on the appropriately prepared surfaces. A modified conductance equation for nanochannels was developed to determine their surface conductance and was found to be in good agreement with our experimental results. The measured surface charge density and zeta potential of these devices were lower than glass nanofluidic devices and dependent on the surface modification adopted, as well as the size of the channel. This property, coupled to an apparent increase in fluid viscosity due to nanoconfinement, contributed to the suppression of the EOF in PMMA nanofluidic devices by an order of magnitude compared to the micro-scale devices. Carboxylated PMMA nanochannels were efficient for the transport and elongation of λ-DNA while these same DNA molecules were unable to translocate through aminated nanochannels.

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Section: Resultsmentioning

confidence: 99%

Surface charge, electroosmotic flow and DNA extension in chemically modified thermoplastic nanoslits and nanochannels

Uba

Pullagurla

Sirasunthorn

et al. 2015

Analyst

Self Cite

105

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“…32,33 It was also found that reducing the elastic modulus is effective in reducing release force. 34 With these approaches, the resist design must include consideration of the pot life, chemical contamination on the mold, adhesion to substrate, and etching resistance. Yet despite the approaches listed above, there is no report of success in achieving mold life that can provide the shot number required for industrial use.…”

Section: Release Propertymentioning

confidence: 99%

Design considerations for ultraviolet-nanoimprint lithography resists

Usuki

Wakamatsu

Oomatsu

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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Design considerations for ultraviolet-nanoimprint lithography resists were investigated focusing on the major issues of ink-jetting performance, pattern formability, release property, and dry etching resistance. Regarding ink-jetting performance, small droplet ink-jetting of 0.7 pl was successfully demonstrated by adjusting the resist fluid property to the ink-jet coater and controlling the resist volatilization. Regarding pattern formability, a resist pattern was imprinted from a mold pattern of 28 nm in width and 60 nm in depth without pattern dimension change. It was thought that modulus control of the resist was more important than resist shrinkage in achieving excellent pattern formability. As for release property, resist with fluorine monomer and with nonreactive fluorine antisticking agent were compared. The results indicated that resist design has the capability to both reduce separation force and maintain a clear mold surface. The mold release agent decomposed with an increasing number of imprint shots, but the low release-force resist with nonreactive antisticking agent was able to control degradation of the mold release agent and thus improve release property endurance. Regarding etching resistance, it was found that increasing the ring parameter of resist is essential for high etching resistance, and resulted in improved etched pattern features of the substrate.

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“…The application of nanoimprint is limited by the yield. Low adhesion force at the de-molding interface is preferred in NIL, to avoid mold sticking and pattern delamination [2]. The adhesion of surfaces on a macro-scale is usually talking about holding two dry, solid surfaces together.…”

Section: Introductionmentioning

confidence: 99%

A multi-scale simulation method to predict delamination and adhesion force in UV-nanoimprint lithography

Zhong

Kwok

Yuen

2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Nanoimprint lithography (NIL) provides a low cost process for nano-pattern mass production. Polymer filling and de-molding processes determine the quality of the imprinted pattern in NIL. In UV-nanoimprint lithography, low viscous polymer reduces the requirement of imprint pressure in polymer filling. The interaction between prepatterned mold and UV-curable polymer during demolding greatly affect the patterning result. Due to the length scale issues, molecular simulation or traditional finite element method cannot individually simulate the de-molding process. Therefore, a multi-scale approach combining both MD simulation and finite element analysis is proposed to predict the adhesion force between the mold and polymer layer in UV-nanoimprint lithography.The present study is focused on incorporating material behavior at the de-molding interface of nano-patterns. Simulation of molecular dynamics is used to calculate the interfacial energy between the polyvinyl alcohol mold and a methacrylate-based resist layer. A stress-displacement curve can be achieved from the slope of the energydisplacement relation. The result is then utilized to characterize the material properties of cohesive zone elements at the finite element model. A contact debonding model is built to simulate the de-molding process. And the model is verified by the results from peel-off experiment.

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Surface adhesion and demolding force dependence on resist composition in ultraviolet nanoimprint lithography

Cited by 44 publications

References 24 publications

Surface charge, electroosmotic flow and DNA extension in chemically modified thermoplastic nanoslits and nanochannels

Surface charge, electroosmotic flow and DNA extension in chemically modified thermoplastic nanoslits and nanochannels

Design considerations for ultraviolet-nanoimprint lithography resists

A multi-scale simulation method to predict delamination and adhesion force in UV-nanoimprint lithography

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