Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

Kozak, Martin; Veselý, Petr

doi:10.1109/isse49702.2020.9120951

Cited by 5 publications

(2 citation statements)

References 7 publications

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“…The approaches presented in this paper have a comparable impact on void formation in solder joints as the temperature profile, or particle size in solder paste [1,3,24]. Nevertheless, the presented approaches are easy to implement and do not cost extra compared to other mentioned solutions, where it is often necessary to change the soldering process parameters or the composition of solder paste.…”

Section: Discussionmentioning

confidence: 98%

“…Effects on void occurrence in solder joints that have been investigated in other studies include, for example, changing the type of surface finish of solder pads or temperature profiles of reflow changing, where the authors suggest that up to approximately 5% improvement can be achieved [1]. Furthermore, the particle size of the solder alloy was investigated in the previous study, yielding an improvement of around 2% [24]. Changing the flux chemistry can also contribute to reducing voids formation [3].…”

Section: Introductionmentioning

confidence: 99%

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Analysis of solder mask roughness and stencil shape influence on void formation in solder joints

2023

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Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is the change of the roughness of the solder mask to influence the flux spreading around the solder pad. The second approach is the deposition of the same volume of the solder paste to the solder pads using a modified, thicker stencil with smaller apertures. The experiments were performed for solder pastes containing SAC305 alloy and two types of fluxes (ROL0/ROL1). Solder joints were inspected by X-ray imaging, and the shots were subsequently processed by image analysis. For determination of the spreading area of the flux around the solder pad during the reflow process, the tested boards were scanned by a confocal digital microscope. The results showed that more aggressive flux caused less voiding in terms of the average area of voids covering the soldering pad. Analysis of samples prepared with modified stencils showed a much lower proportion of voids than with the standard stencil. Furthermore, the results revealed that the selection of the solder mask type significantly influenced the voids’ formation within solder joints in the case of the unmodified stencil for solder paste deposition. On the other hand, when the modified stencils were used for sample preparation, the solder mask had no further impact on voiding. Therefore, modifying the stencil can be pointed out as a preferable and effective way.

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Section: Discussionmentioning

confidence: 98%