Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

Kozak, Martin; Vesely, Petr; Pilnaj, Dominik; Uricar, Jonas; Dusek, Karel

doi:10.1007/s40194-024-01824-3

Weld World

2024

DOI: 10.1007/s40194-024-01824-3

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Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

Martin Kozak,

Petr Vesely,

Dominik Pilnaj

et al.

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Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

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References 28 publications

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